JPH02122436U - - Google Patents

Info

Publication number
JPH02122436U
JPH02122436U JP3110889U JP3110889U JPH02122436U JP H02122436 U JPH02122436 U JP H02122436U JP 3110889 U JP3110889 U JP 3110889U JP 3110889 U JP3110889 U JP 3110889U JP H02122436 U JPH02122436 U JP H02122436U
Authority
JP
Japan
Prior art keywords
resin
dispensing device
sealing
circuit board
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3110889U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3110889U priority Critical patent/JPH02122436U/ja
Publication of JPH02122436U publication Critical patent/JPH02122436U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの考案にかかるエポキシ系封止剤樹
脂吐出装置の断面図、第2図は従来のエポキシ系
封止剤樹脂吐出装置の断面図である。
FIG. 1 is a sectional view of an epoxy sealant resin dispensing device according to this invention, and FIG. 2 is a sectional view of a conventional epoxy sealant resin dispensing device.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 回路基板上に実装した半導体素子を樹脂封止す
るためのエポキシ系封止樹脂の樹脂吐出装置にお
いて、樹脂吐出装置吐出先端外部がシリコン樹脂
で形成されている事を特徴とする樹脂吐出装置の
構造。
A structure of a resin dispensing device for epoxy sealing resin for resin-sealing semiconductor elements mounted on a circuit board, characterized in that the outside of the discharging tip of the resin dispensing device is formed of silicone resin. .
JP3110889U 1989-03-17 1989-03-17 Pending JPH02122436U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3110889U JPH02122436U (en) 1989-03-17 1989-03-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3110889U JPH02122436U (en) 1989-03-17 1989-03-17

Publications (1)

Publication Number Publication Date
JPH02122436U true JPH02122436U (en) 1990-10-08

Family

ID=31256721

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3110889U Pending JPH02122436U (en) 1989-03-17 1989-03-17

Country Status (1)

Country Link
JP (1) JPH02122436U (en)

Similar Documents

Publication Publication Date Title
JPH02122436U (en)
JPH028043U (en)
JPH0375539U (en)
JPH0267649U (en)
JPH0270450U (en)
JPH0231149U (en)
JPS63128745U (en)
JPH01104720U (en)
JPS6420738U (en)
JPS61114842U (en)
JPH01129847U (en)
JPS61111160U (en)
JPH0281059U (en)
JPH024261U (en)
JPH0323945U (en)
JPS63124754U (en)
JPH0279046U (en)
JPH01139441U (en)
JPS63137954U (en)
JPH02101547U (en)
JPS5834741U (en) Resin-encapsulated semiconductor device
JPH0249139U (en)
JPS62122354U (en)
JPH0328756U (en)
JPH0263543U (en)