JPS61205150U - - Google Patents
Info
- Publication number
- JPS61205150U JPS61205150U JP7309986U JP7309986U JPS61205150U JP S61205150 U JPS61205150 U JP S61205150U JP 7309986 U JP7309986 U JP 7309986U JP 7309986 U JP7309986 U JP 7309986U JP S61205150 U JPS61205150 U JP S61205150U
- Authority
- JP
- Japan
- Prior art keywords
- insulating base
- semiconductor device
- electrode lead
- brazed
- recesses
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 description 1
- 239000006023 eutectic alloy Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
Description
第１図は従来のパツケージを示す底面図、第２
図は従来のパツケージを示す断面図、第３図は本
考案の一実施例によるパツケージを示す底面図、
第４図はそのリード接着部の断面図である。
１，１１……半導体パツケージ（絶縁基体）、
２，１２……電極引出しリード、３，１３……銀
銅共晶合金、４，１４……メタライズ部、５，１
５……半導体素子、６，１６……金線、１７……
凹部、１８……貫通孔。
Figure 1 is a bottom view of a conventional package;
The figure is a sectional view showing a conventional package, and FIG. 3 is a bottom view showing a package according to an embodiment of the present invention.
FIG. 4 is a sectional view of the lead bonding portion. 1, 11... semiconductor package (insulating base),
2, 12... Electrode extraction lead, 3, 13... Silver-copper eutectic alloy, 4, 14... Metallized part, 5, 1
5... Semiconductor element, 6, 16... Gold wire, 17...
Recessed portion, 18...through hole.
Claims (1)
置において、絶縁基体と電極引出しリードのロー
付けする部分に複数の凹部あるいは貫通孔を有す
ることを特徴とする半導体装置。 1. A semiconductor device having an insulating base and an electrode lead, the semiconductor device having a plurality of recesses or through holes in a portion where the insulating base and the electrode lead are brazed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7309986U JPS61205150U (en) | 1986-05-15 | 1986-05-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7309986U JPS61205150U (en) | 1986-05-15 | 1986-05-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61205150U true JPS61205150U (en) | 1986-12-24 |
Family
ID=30612145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7309986U Pending JPS61205150U (en) | 1986-05-15 | 1986-05-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61205150U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5348465A (en) * | 1976-10-15 | 1978-05-01 | Hitachi Ltd | Connecting method of lead frame utilizing through-holes |
| JPS54132615A (en) * | 1978-04-05 | 1979-10-15 | Ngk Spark Plug Co | Ceramiccmetal parts brazed structure |
-
1986
- 1986-05-15 JP JP7309986U patent/JPS61205150U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5348465A (en) * | 1976-10-15 | 1978-05-01 | Hitachi Ltd | Connecting method of lead frame utilizing through-holes |
| JPS54132615A (en) * | 1978-04-05 | 1979-10-15 | Ngk Spark Plug Co | Ceramiccmetal parts brazed structure |