JPH0336137U - - Google Patents
Info
- Publication number
- JPH0336137U JPH0336137U JP1989097546U JP9754689U JPH0336137U JP H0336137 U JPH0336137 U JP H0336137U JP 1989097546 U JP1989097546 U JP 1989097546U JP 9754689 U JP9754689 U JP 9754689U JP H0336137 U JPH0336137 U JP H0336137U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- package
- sectional
- view
- metal conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 2
- 238000005219 brazing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図はこの考案の一実施例である半導体装置
用パツケージ断面図、第２図は第１図のパツケー
ジを用いた半導体装置の断面図、第３図は従来の
半導体装置用パツケージの断面図、第４図は第３
図のパツケージを用いた半導体装置の断面図であ
る。
図において、１……金属導体ベース、２……絶
縁板、３……リード、４……半導体チツプ、５…
…ろう材、６……金属板、７……整合基板、８…
金属細線を示す。なお、図中、同一符号は同一、
または相当部分を示す。
FIG. 1 is a sectional view of a package for a semiconductor device that is an embodiment of this invention, FIG. 2 is a sectional view of a semiconductor device using the package of FIG. 1, and FIG. 3 is a sectional view of a conventional package for a semiconductor device. , Figure 4 is the third
FIG. 2 is a cross-sectional view of a semiconductor device using the package shown in the figure. In the figure, 1...metal conductor base, 2...insulating plate, 3...lead, 4...semiconductor chip, 5...
...Brazing metal, 6...Metal plate, 7...Matching substrate, 8...
Shows a thin metal wire. In addition, in the figure, the same reference numerals are the same,
or a significant portion.
Claims (1)
面を湾曲させたことを特徴とする半導体装置用パ
ツケージ。 A package for a semiconductor device characterized by having a curved bottom surface of a metal conductor base that serves as a mounting base for the semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989097546U JPH0336137U (en) | 1989-08-21 | 1989-08-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989097546U JPH0336137U (en) | 1989-08-21 | 1989-08-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0336137U true JPH0336137U (en) | 1991-04-09 |
Family
ID=31646682
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989097546U Pending JPH0336137U (en) | 1989-08-21 | 1989-08-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0336137U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007112495A (en) * | 2005-10-21 | 2007-05-10 | Sankosha Engineering:Kk | Three-dimensional wrapping machine for clothes |
| JP2007136153A (en) * | 2005-10-21 | 2007-06-07 | Sankosha Engineering:Kk | Hanger for cubic packaging |
| KR200475299Y1 (en) * | 2013-07-03 | 2014-11-19 | 이은영 | Vinyl Cover for storage of clothing magnet is coupled |
-
1989
- 1989-08-21 JP JP1989097546U patent/JPH0336137U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007112495A (en) * | 2005-10-21 | 2007-05-10 | Sankosha Engineering:Kk | Three-dimensional wrapping machine for clothes |
| JP2007136153A (en) * | 2005-10-21 | 2007-06-07 | Sankosha Engineering:Kk | Hanger for cubic packaging |
| KR200475299Y1 (en) * | 2013-07-03 | 2014-11-19 | 이은영 | Vinyl Cover for storage of clothing magnet is coupled |