JPH0235443U - - Google Patents
Info
- Publication number
- JPH0235443U JPH0235443U JP11288588U JP11288588U JPH0235443U JP H0235443 U JPH0235443 U JP H0235443U JP 11288588 U JP11288588 U JP 11288588U JP 11288588 U JP11288588 U JP 11288588U JP H0235443 U JPH0235443 U JP H0235443U
- Authority
- JP
- Japan
- Prior art keywords
- solder material
- semiconductor device
- metal base
- fixed
- convex part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims 2
- 239000003990 capacitor Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
Landscapes
- Microwave Amplifiers (AREA)
- Wire Bonding (AREA)
- Waveguides (AREA)
Description
第１図ａ，ｂは本考案の一実施例による半導体
装置を示す上面図および断面正面図、第２図ａ，
ｂは従来の半導体装置の上面図および正面断面図
である。
図において、１は金属基体、２は平面回路基板
、３ａ，３ｂ，３ｃは平面回路を構成する金属薄
膜、４は半導体チツプ、５は半田材、７は金属細
線、８はキヤパシタである。なお、図中、同一符
号は同一、または相当部分を示す。
1a and 1b are a top view and a sectional front view showing a semiconductor device according to an embodiment of the present invention, and FIGS.
b is a top view and a front sectional view of a conventional semiconductor device. In the figure, 1 is a metal base, 2 is a planar circuit board, 3a, 3b, 3c are metal thin films constituting a planar circuit, 4 is a semiconductor chip, 5 is a solder material, 7 is a thin metal wire, and 8 is a capacitor. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
て固着されている半導体装置において、前記金属
基体の一部に凸部を設け、前記整合基板の端面を
前記凸部に密着させて半田材で固着し、前記半田
材を整合基板表面へしみ出させ短絡回路を形成し
たことを特徴とする半導体装置。 In a semiconductor device in which a semiconductor chip or a matching substrate is fixed to a metal base with a solder material, a convex part is provided in a part of the metal base, and an end face of the matching board is brought into close contact with the convex part and fixed with a solder material. A semiconductor device characterized in that the solder material seeps out onto the surface of the matching substrate to form a short circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11288588U JPH0235443U (en) | 1988-08-29 | 1988-08-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11288588U JPH0235443U (en) | 1988-08-29 | 1988-08-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0235443U true JPH0235443U (en) | 1990-03-07 |
Family
ID=31352232
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11288588U Pending JPH0235443U (en) | 1988-08-29 | 1988-08-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0235443U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0992955A (en) * | 1995-07-18 | 1997-04-04 | Mitsubishi Electric Corp | Electronic device |
| JP2000091802A (en) * | 1998-09-11 | 2000-03-31 | Matsushita Electric Ind Co Ltd | Microwave circuit |
-
1988
- 1988-08-29 JP JP11288588U patent/JPH0235443U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0992955A (en) * | 1995-07-18 | 1997-04-04 | Mitsubishi Electric Corp | Electronic device |
| JP2000091802A (en) * | 1998-09-11 | 2000-03-31 | Matsushita Electric Ind Co Ltd | Microwave circuit |