JPS63144704U - - Google Patents
Info
- Publication number
- JPS63144704U JPS63144704U JP3707587U JP3707587U JPS63144704U JP S63144704 U JPS63144704 U JP S63144704U JP 3707587 U JP3707587 U JP 3707587U JP 3707587 U JP3707587 U JP 3707587U JP S63144704 U JPS63144704 U JP S63144704U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- line
- integrated circuit
- devices
- coplanar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
Landscapes
- Waveguide Connection Structure (AREA)
- Waveguides (AREA)
Description
第１図はこの考案の一実施例によるマイクロ波
集積回路を示す平面図、第２図はそのＡ―Ａ線断
面図、第３図はこの考案の他の実施例を示す平面
図、第４図はそのＡ―Ａ線断面図、第５図は従来
のマイクロ波集積回路を示す縦断面図である。
３，４は基板、８，９は表面パターン、１０，
１１はマイクロストリツプ線路、１３は裏面パタ
ーン、１８，１９はコプレナー型ストリツプ線路
。なお、図中、同一符号は同一、又は相当部分を
示す。
FIG. 1 is a plan view showing a microwave integrated circuit according to an embodiment of this invention, FIG. 2 is a sectional view taken along the line AA, FIG. 3 is a plan view showing another embodiment of this invention, The figure is a cross-sectional view taken along the line AA, and FIG. 5 is a vertical cross-sectional view showing a conventional microwave integrated circuit. 3 and 4 are substrates, 8 and 9 are surface patterns, 10,
11 is a microstrip line, 13 is a back pattern, and 18 and 19 are coplanar strip lines. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
波集積回路のマイクロストリツプ線路を他のデバ
イスとの接続個所の近傍で、基板の裏面パターン
を無くし、その下に空間を設け、前記基板の表面
でコプレナーストリツプ線路に変換し、前記基板
の表面の前記コプレナーストリツプ線路のアース
であるアースパターンを金リボン等で各デバイス
のアースを、接続することを特徴とするマイクロ
波集積回路。 In the connection of microwave devices, the back surface pattern of the substrate is removed near the connection point of the microstrip line of the microwave integrated circuit with other devices, and a space is provided below, and a coplanar line is formed on the surface of the substrate. A microwave integrated circuit characterized in that the ground pattern of the coplanar strip line on the surface of the substrate is converted into a strip line, and the ground of each device is connected with a gold ribbon or the like.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3707587U JPS63144704U (en) | 1987-03-13 | 1987-03-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3707587U JPS63144704U (en) | 1987-03-13 | 1987-03-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63144704U true JPS63144704U (en) | 1988-09-22 |
Family
ID=30848072
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3707587U Pending JPS63144704U (en) | 1987-03-13 | 1987-03-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63144704U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007037010A (en) * | 2005-07-29 | 2007-02-08 | Mitsubishi Electric Corp | High frequency circuit module |
-
1987
- 1987-03-13 JP JP3707587U patent/JPS63144704U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007037010A (en) * | 2005-07-29 | 2007-02-08 | Mitsubishi Electric Corp | High frequency circuit module |