JPH0272003U - - Google Patents
Info
- Publication number
- JPH0272003U JPH0272003U JP15140488U JP15140488U JPH0272003U JP H0272003 U JPH0272003 U JP H0272003U JP 15140488 U JP15140488 U JP 15140488U JP 15140488 U JP15140488 U JP 15140488U JP H0272003 U JPH0272003 U JP H0272003U
- Authority
- JP
- Japan
- Prior art keywords
- lower surfaces
- dielectric substrate
- line
- connection
- ground conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 claims 2
- 230000005570 vertical transmission Effects 0.000 claims 1
Landscapes
- Waveguides (AREA)
Description
第１図、第２図はこの考案の一実施例によるマ
イクロ波垂直接続線路を示す平面図および―
線における断面図、第３図、第４図はこの考案の
他の実施例を示す平面図および―線における
断面図、第５図、第６図は従来のマイクロ波垂直
接続線路の平面図および―線における断面図
である。図において、１ａ〜１ｄは誘電体基板、
２は地導体、３ａ〜３ｃはスルーホール、４は上
下面接続用誘電体基板、５ａ，５ｂは線路パター
ンを示す。なお、図中、同一符号は同一、または
相当部分を示す。
Figures 1 and 2 are plan views showing a microwave vertical connection line according to an embodiment of the invention, and -
3 and 4 are plan views showing other embodiments of the invention; - is a cross-sectional view along the line. In the figure, 1a to 1d are dielectric substrates,
2 is a ground conductor, 3a to 3c are through holes, 4 is a dielectric substrate for connecting the upper and lower surfaces, and 5a and 5b are line patterns. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
るマイクロ波平面伝送線路と、上下面の平面伝送
線路を垂直に接続するスルーホールを設けた上下
面接続用誘電体基板及び地導体よりなるマイクロ
波垂直接続線路において、垂直方向の伝送路を前
記地導体と前記接続用誘電体基板に設けられたス
ルーホール及び前記上下面の誘電体基板に設けら
れたスルーホールの接触によつて形成したことを
特徴とするマイクロ波垂直接続線路。 Microwave planar transmission line consisting of dielectric substrates on the upper and lower surfaces, a line pattern, and a dielectric substrate for connection on the upper and lower surfaces with through holes for vertically connecting the planar transmission lines on the upper and lower surfaces, and a ground conductor. In the vertical connection line, a vertical transmission path is formed by contact between the ground conductor, a through hole provided in the connection dielectric substrate, and a through hole provided in the dielectric substrate on the upper and lower surfaces. Features a microwave vertical connection line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15140488U JPH0272003U (en) | 1988-11-21 | 1988-11-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15140488U JPH0272003U (en) | 1988-11-21 | 1988-11-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0272003U true JPH0272003U (en) | 1990-06-01 |
Family
ID=31425421
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15140488U Pending JPH0272003U (en) | 1988-11-21 | 1988-11-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0272003U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016158095A (en) * | 2015-02-24 | 2016-09-01 | 日立金属株式会社 | Antenna device |
-
1988
- 1988-11-21 JP JP15140488U patent/JPH0272003U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016158095A (en) * | 2015-02-24 | 2016-09-01 | 日立金属株式会社 | Antenna device |