JPH0292965U - - Google Patents
Info
- Publication number
- JPH0292965U JPH0292965U JP141389U JP141389U JPH0292965U JP H0292965 U JPH0292965 U JP H0292965U JP 141389 U JP141389 U JP 141389U JP 141389 U JP141389 U JP 141389U JP H0292965 U JPH0292965 U JP H0292965U
- Authority
- JP
- Japan
- Prior art keywords
- holes
- substrate
- conductor pattern
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 3
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図ａ及びｂはそれぞれ本考案の一実施例の
平面図及びＡ―Ａ′線断面図、第２図ａ及びｂは
それぞれ従来の印刷配線板の一例の平面図及びＢ
―Ｂ′線断面図である。
１，１ａ……連結基板、２，２ａ，３，３ａ…
…基板、４……ミシン目穴、５，５ａ，５ｂ，６
……導体パターン、７……スルーホール、８……
ランド、９，９ａ，９ｂ……導体パターン。
1A and 1B are a plan view and a sectional view taken along the line A-A' of an embodiment of the present invention, respectively, and FIGS. 2A and 2B are a plan view and B of an example of a conventional printed wiring board, respectively.
-B' line sectional view. 1,1a ...Connection board, 2,2a , 3,3a ...
...Substrate, 4...Perforation, 5, 5 a , 5 b , 6
...Conductor pattern, 7...Through hole, 8...
Land, 9, 9a , 9b...conductor pattern.
Claims (1)
直線上に形成した複数のミシン目穴で分断され該
ミシン目穴の近傍に前記ミシン目穴を狭んで対向
して形成されるそれぞれ複数のスルーホールを有
する少くとも２枚の第１の基板と第２の基板とか
ら成る連結基板と、該連結基板の表面上に形成さ
れ前記ミシン目穴間を通過して前記第１の基板と
第２の基板の対向する前記スルーホール間を接続
する導体パターンとを有することを特徴とする印
刷配線板。 A plurality of through holes are divided by a plurality of perforations that penetrate in a direction perpendicular to the surface and are formed in a straight line in a predetermined direction, and each of the through holes is formed in the vicinity of the perforation hole so as to be narrowly opposed to each other. a connecting substrate consisting of at least two first substrates and a second substrate having holes; A printed wiring board comprising: a conductor pattern connecting the through holes facing each other in the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP141389U JPH0292965U (en) | 1989-01-09 | 1989-01-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP141389U JPH0292965U (en) | 1989-01-09 | 1989-01-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0292965U true JPH0292965U (en) | 1990-07-24 |
Family
ID=31201278
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP141389U Pending JPH0292965U (en) | 1989-01-09 | 1989-01-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0292965U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017144103A (en) * | 2016-02-18 | 2017-08-24 | 三菱電機株式会社 | Electric device, electronic circuit board provided in electric device, and replacement method of electronic circuit board |
-
1989
- 1989-01-09 JP JP141389U patent/JPH0292965U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017144103A (en) * | 2016-02-18 | 2017-08-24 | 三菱電機株式会社 | Electric device, electronic circuit board provided in electric device, and replacement method of electronic circuit board |