JPH0470759U - - Google Patents
Info
- Publication number
- JPH0470759U JPH0470759U JP11331390U JP11331390U JPH0470759U JP H0470759 U JPH0470759 U JP H0470759U JP 11331390 U JP11331390 U JP 11331390U JP 11331390 U JP11331390 U JP 11331390U JP H0470759 U JPH0470759 U JP H0470759U
- Authority
- JP
- Japan
- Prior art keywords
- wiring patterns
- electrically connected
- short
- insulating substrate
- patterns electrically
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 3
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図は本考案のプリント基板の一実施例を示
す平面図、第２図は従来のプリント基板の一例を
示す平面図である。
１，１１……絶縁基板、２，２′，１２……ラ
ンド、３，４，１３，１４……スルーホール、５
，５′……太い配線パターン、６，６′……細い
配線パターン。
FIG. 1 is a plan view showing an embodiment of the printed circuit board of the present invention, and FIG. 2 is a plan view showing an example of a conventional printed circuit board. 1, 11... Insulating substrate, 2, 2', 12... Land, 3, 4, 13, 14... Through hole, 5
, 5'... Thick wiring pattern, 6, 6'... Thin wiring pattern.
Claims (1)
ホールを有する絶縁基板と、前記各スルーホール
のまわりに設けた複数のランドと、前記絶縁基板
の一方面上で前記格子状の縦方向の各列ごとに前
記各ランドと第１の短く細い配線パターンを介し
て電気的に接続した複数の第１の太い配線パター
ンと、前記絶縁基板の他方面上で前記格子状の横
方向の各行ごとに前記各ランドと第２の短く細い
配線パターンを介して電気的に接続した複数の第
２の太い配線パターンとを備えることを特徴とす
るプリント基板。 an insulating substrate having a plurality of through holes arranged in a grid pattern; a plurality of lands provided around each of the through holes; a plurality of first thick wiring patterns electrically connected to each land via a first short thin wiring pattern for each column; and a plurality of first thick wiring patterns electrically connected to each land via a first short thin wiring pattern, and for each row in the horizontal direction of the grid on the other surface of the insulating substrate. A printed circuit board comprising a plurality of second thick wiring patterns electrically connected to each of the lands via second short and thin wiring patterns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11331390U JPH0470759U (en) | 1990-10-29 | 1990-10-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11331390U JPH0470759U (en) | 1990-10-29 | 1990-10-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0470759U true JPH0470759U (en) | 1992-06-23 |
Family
ID=31860881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11331390U Pending JPH0470759U (en) | 1990-10-29 | 1990-10-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0470759U (en) |
-
1990
- 1990-10-29 JP JP11331390U patent/JPH0470759U/ja active Pending