JPH031545U - - Google Patents

Info

Publication number
JPH031545U
JPH031545U JP6043689U JP6043689U JPH031545U JP H031545 U JPH031545 U JP H031545U JP 6043689 U JP6043689 U JP 6043689U JP 6043689 U JP6043689 U JP 6043689U JP H031545 U JPH031545 U JP H031545U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
wiring
signal layer
branch wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6043689U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6043689U priority Critical patent/JPH031545U/ja
Publication of JPH031545U publication Critical patent/JPH031545U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案によるプリント基板の構成を示
す断面図、第2図は従来のプリント基板の構成を
示す断面図である。 図において、10はプリント基板、11はLS
I素子、12は信号層、13はプローブ用ランド
である。
FIG. 1 is a sectional view showing the structure of a printed circuit board according to the present invention, and FIG. 2 is a sectional view showing the structure of a conventional printed circuit board. In the figure, 10 is a printed circuit board, 11 is LS
An I element, 12 a signal layer, and 13 a probe land.

Claims (1)

【実用新案登録請求の範囲】 表面に複数のLSI素子11を塔載し、上記の
LSI素子11間に配線される所定パターンの信
号層12を内層したプリント基板10において、 前記信号層12から配線を分岐させて、この分
岐配線の先端を基板表面に露出させて、プローブ
用ランド13を形成したことを特徴とするプリン
ト基板。
[Claims for Utility Model Registration] In a printed circuit board 10 having a plurality of LSI elements 11 mounted on its surface and having a signal layer 12 of a predetermined pattern wired between the LSI elements 11 as an inner layer, wiring from the signal layer 12 is provided. A printed circuit board characterized in that a probe land 13 is formed by branching the branch wiring and exposing the tip of the branch wiring on the substrate surface.
JP6043689U 1989-05-26 1989-05-26 Pending JPH031545U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6043689U JPH031545U (en) 1989-05-26 1989-05-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6043689U JPH031545U (en) 1989-05-26 1989-05-26

Publications (1)

Publication Number Publication Date
JPH031545U true JPH031545U (en) 1991-01-09

Family

ID=31587798

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6043689U Pending JPH031545U (en) 1989-05-26 1989-05-26

Country Status (1)

Country Link
JP (1) JPH031545U (en)

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