JPH0286165U - - Google Patents
Info
- Publication number
- JPH0286165U JPH0286165U JP16541888U JP16541888U JPH0286165U JP H0286165 U JPH0286165 U JP H0286165U JP 16541888 U JP16541888 U JP 16541888U JP 16541888 U JP16541888 U JP 16541888U JP H0286165 U JPH0286165 U JP H0286165U
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- printed wiring
- leading edge
- needle
- ground
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000009972 noncorrosive effect Effects 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の一実施例の平面図、第２図ａ
およびｂはそれぞれ本考案のパターンの拡大図で
ある。
１…印刷配線基板、２…信号パターン、２ａ，
３ａ…針状パターン、３…グランドパターン、４
…半導体素子。
Figure 1 is a plan view of an embodiment of the present invention, Figure 2 a
and b are enlarged views of the pattern of the present invention, respectively. 1...Printed wiring board, 2...Signal pattern, 2a,
3a...Acicular pattern, 3...Ground pattern, 4
...Semiconductor element.
Claims (1)
号パターンおよびグランドパターンの少なくとも
１方に針状パターンを設け、この針状パターンの
最先端部において前記信号パターンとグランドパ
ターンとの間隔を狭くすることを特徴とする印刷
配線。 ２ 請求項１記載の印刷配線において、針状パタ
ーンの最先端部とこの最先端部に対向するパター
ンの局部とに非腐蝕性の鍍金を施し露出すること
を特徴とする印刷配線。[Claims for Utility Model Registration] 1. In printed wiring provided on a printed wiring board, a needle-like pattern is provided on at least one of a signal pattern and a ground pattern, and the signal pattern and the ground pattern are arranged at the leading edge of the needle-like pattern. Printed wiring characterized by narrowing the distance between the two. 2. The printed wiring according to claim 1, wherein the leading edge of the acicular pattern and a local portion of the pattern facing the leading edge are exposed with non-corrosive plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16541888U JPH0286165U (en) | 1988-12-20 | 1988-12-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16541888U JPH0286165U (en) | 1988-12-20 | 1988-12-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0286165U true JPH0286165U (en) | 1990-07-09 |
Family
ID=31451885
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16541888U Pending JPH0286165U (en) | 1988-12-20 | 1988-12-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0286165U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014184090A (en) * | 2013-03-25 | 2014-10-02 | Daito Giken:Kk | Circuit board for game machine |
| JPWO2017208343A1 (en) * | 2016-05-31 | 2018-10-18 | 三菱電機株式会社 | Semiconductor device, ignition device for internal combustion engine, and internal combustion engine system |
-
1988
- 1988-12-20 JP JP16541888U patent/JPH0286165U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014184090A (en) * | 2013-03-25 | 2014-10-02 | Daito Giken:Kk | Circuit board for game machine |
| JPWO2017208343A1 (en) * | 2016-05-31 | 2018-10-18 | 三菱電機株式会社 | Semiconductor device, ignition device for internal combustion engine, and internal combustion engine system |