JPH0263566U - - Google Patents

Info

Publication number
JPH0263566U
JPH0263566U JP14326188U JP14326188U JPH0263566U JP H0263566 U JPH0263566 U JP H0263566U JP 14326188 U JP14326188 U JP 14326188U JP 14326188 U JP14326188 U JP 14326188U JP H0263566 U JPH0263566 U JP H0263566U
Authority
JP
Japan
Prior art keywords
conductive pattern
resist
wiring board
utility
forming portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14326188U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14326188U priority Critical patent/JPH0263566U/ja
Publication of JPH0263566U publication Critical patent/JPH0263566U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図a、第1図bは本考案の第1の実施例に
おけるそれぞれ表面、裏面を示す平面図、第2図
a、第2図b、第2図cは本考案の第2の実施例
における部品取り付け前の基板表面、部品取り付
け後の基板表面、部品取り付け面の裏面をそれぞ
れ示す平面図、第3図a、第3図bは本考案の第
3の実施例を示すそれぞれ基板表面、基板裏面を
示す平面図である。
Figures 1a and 1b are plan views showing the front and back sides, respectively, of the first embodiment of the present invention, and Figures 2a, 2b, and 2c are plan views of the second embodiment of the present invention. FIGS. 3A and 3B are plan views respectively showing the surface of the board before parts are attached, the surface of the board after parts are mounted, and the back side of the part mounting surface in the example. FIGS. , is a plan view showing the back surface of the substrate.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 導体パターンを形成され透光性を有する配線基
板表面に認識マークを形成するとともに、該認識
マークの形成位置に対応する前記認識マーク形成
面の裏面側における前記基板上を、導体パターン
、レジスト等の非形成部としたことを特徴とする
基板装置。
A recognition mark is formed on the surface of a translucent wiring board on which a conductive pattern is formed, and a conductive pattern, resist, etc. A substrate device characterized by having a non-forming portion.
JP14326188U 1988-10-31 1988-10-31 Pending JPH0263566U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14326188U JPH0263566U (en) 1988-10-31 1988-10-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14326188U JPH0263566U (en) 1988-10-31 1988-10-31

Publications (1)

Publication Number Publication Date
JPH0263566U true JPH0263566U (en) 1990-05-11

Family

ID=31409923

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14326188U Pending JPH0263566U (en) 1988-10-31 1988-10-31

Country Status (1)

Country Link
JP (1) JPH0263566U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6059552B2 (en) * 1979-04-10 1985-12-25 シナノケンシ株式会社 time management device
JPS61124190A (en) * 1984-11-20 1986-06-11 松下電器産業株式会社 Printed wiring board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6059552B2 (en) * 1979-04-10 1985-12-25 シナノケンシ株式会社 time management device
JPS61124190A (en) * 1984-11-20 1986-06-11 松下電器産業株式会社 Printed wiring board

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