JPH0353863U - - Google Patents

Info

Publication number
JPH0353863U
JPH0353863U JP11568789U JP11568789U JPH0353863U JP H0353863 U JPH0353863 U JP H0353863U JP 11568789 U JP11568789 U JP 11568789U JP 11568789 U JP11568789 U JP 11568789U JP H0353863 U JPH0353863 U JP H0353863U
Authority
JP
Japan
Prior art keywords
case
mounting surface
mounting
wiring board
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11568789U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11568789U priority Critical patent/JPH0353863U/ja
Publication of JPH0353863U publication Critical patent/JPH0353863U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図及び第2図は本考案の第1実施例を示し
、第1図は分解斜視図、第2図は要部の平面図、
第3図は本考案の第2実施例を示す平面図、第4
図乃至第6図は従来例を示し、第4図は断面図、
第5図は平面図、第6図は断面図である。 1…印刷配線基板、2…電子部品、3…実装面
、4…ケース、5,5A…ケース取付パターン。
1 and 2 show a first embodiment of the present invention, FIG. 1 is an exploded perspective view, FIG. 2 is a plan view of main parts,
Figure 3 is a plan view showing the second embodiment of the present invention;
Figures 6 to 6 show conventional examples, and Figure 4 is a sectional view;
FIG. 5 is a plan view, and FIG. 6 is a sectional view. 1... Printed wiring board, 2... Electronic component, 3... Mounting surface, 4... Case, 5, 5A... Case mounting pattern.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電子部品が実装された実装面をケースに当接し
て取付け固定される印刷配線基板において、前記
実装面に前記ケースが当接する箇所を示すケース
取付パターンを設けたことを特徴とする印刷配線
基板。
A printed wiring board on which a mounting surface on which electronic components are mounted is attached and fixed by contacting a case, characterized in that a case mounting pattern is provided on the mounting surface to indicate a location where the case comes into contact.
JP11568789U 1989-09-29 1989-09-29 Pending JPH0353863U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11568789U JPH0353863U (en) 1989-09-29 1989-09-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11568789U JPH0353863U (en) 1989-09-29 1989-09-29

Publications (1)

Publication Number Publication Date
JPH0353863U true JPH0353863U (en) 1991-05-24

Family

ID=31664006

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11568789U Pending JPH0353863U (en) 1989-09-29 1989-09-29

Country Status (1)

Country Link
JP (1) JPH0353863U (en)

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