JPH0448657U - - Google Patents
Info
- Publication number
- JPH0448657U JPH0448657U JP9082590U JP9082590U JPH0448657U JP H0448657 U JPH0448657 U JP H0448657U JP 9082590 U JP9082590 U JP 9082590U JP 9082590 U JP9082590 U JP 9082590U JP H0448657 U JPH0448657 U JP H0448657U
- Authority
- JP
- Japan
- Prior art keywords
- printed
- case
- mounting surface
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005286 illumination Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図乃至第３図は本考案の第１実施例を示し
、第１図は分解斜視図、第２図は要部の平面図、
第３図は断面図、第４図は本考案の変形例を示す
要部の平面図、第５図乃至第７図は従来例を示し
、第５図は断面図、第６図は平面図、第７図は断
面図である。
１……印刷配線基板、２……電子部品、２Ａ…
…照明ランプ、３……実装面、４……ケース、１
５，１５Ａ……ケース取付パターン。
1 to 3 show a first embodiment of the present invention, FIG. 1 is an exploded perspective view, FIG. 2 is a plan view of main parts,
Fig. 3 is a sectional view, Fig. 4 is a plan view of essential parts showing a modification of the present invention, Figs. 5 to 7 show a conventional example, Fig. 5 is a sectional view, and Fig. 6 is a plan view. , FIG. 7 is a cross-sectional view. 1...Printed wiring board, 2...Electronic component, 2A...
...Illumination lamp, 3...Mounting surface, 4...Case, 1
5,15A...Case mounting pattern.
Claims (1)
ケースに当接して取付け固定する印刷配線基板に
おいて、前記実装面に反射層を印刷形成し、この
印刷層を抜き印刷してケースとの当接箇所を示す
ケース取付パターンを設けたことを特徴とする印
刷配線基板。 In a printed wiring board where the mounting surface on which electronic components and lighting lamps are mounted is attached and fixed by contacting the case, a reflective layer is printed on the mounting surface, this printed layer is removed and printed, and the mounting surface is brought into contact with the case. A printed wiring board characterized by having a case mounting pattern indicating locations.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9082590U JPH0448657U (en) | 1990-08-29 | 1990-08-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9082590U JPH0448657U (en) | 1990-08-29 | 1990-08-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0448657U true JPH0448657U (en) | 1992-04-24 |
Family
ID=31825895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9082590U Pending JPH0448657U (en) | 1990-08-29 | 1990-08-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0448657U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999021735A1 (en) * | 1997-10-23 | 1999-05-06 | Nippon Seiki Co., Ltd. | Instrumentation for vehicles |
-
1990
- 1990-08-29 JP JP9082590U patent/JPH0448657U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999021735A1 (en) * | 1997-10-23 | 1999-05-06 | Nippon Seiki Co., Ltd. | Instrumentation for vehicles |