JPS63155668U - - Google Patents
Info
- Publication number
- JPS63155668U JPS63155668U JP4890287U JP4890287U JPS63155668U JP S63155668 U JPS63155668 U JP S63155668U JP 4890287 U JP4890287 U JP 4890287U JP 4890287 U JP4890287 U JP 4890287U JP S63155668 U JPS63155668 U JP S63155668U
- Authority
- JP
- Japan
- Prior art keywords
- copper layer
- printed wiring
- marks
- marks formed
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 238000005530 etching Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Description
第１図は本考案における印刷配線基板の概略を
示す全体の平面図、第２図ａ，ｂはそれぞれ本考
案の第一の実施例を説明するための表面拡大平面
図および裏面拡大平面図、第３図ａ，ｂはそれぞ
れ本考案の第二の実施例を説明するための表面拡
大平面図および裏面拡大平面図、第４図は従来の
印刷配線基板の概略を示す全体の平面図、第５図
および第６図は共に従来の印刷配線基板の拡大平
面図である。
１……印刷配線基板、２……印刷位置及び表裏
位置ずれ確認マーク、３……貫通孔、４……配線
パターン、５……正方形クリアランス状マーク、
６……正方形状マーク、７……円形クリアランス
状マーク、８……円形状マーク。
FIG. 1 is an overall plan view schematically showing a printed wiring board according to the present invention, and FIGS. 2 a and 2 b are an enlarged front view and an enlarged back plan view, respectively, for explaining the first embodiment of the invention. 3a and 3b are respectively an enlarged front view and an enlarged back view for explaining the second embodiment of the present invention; FIG. 4 is an overall plan view schematically showing a conventional printed wiring board; 5 and 6 are both enlarged plan views of conventional printed wiring boards. DESCRIPTION OF SYMBOLS 1...Printed wiring board, 2...Mark for checking printing position and front/back position deviation, 3...Through hole, 4...Wiring pattern, 5...Square clearance mark,
6...Square mark, 7...Circular clearance mark, 8...Circular mark.
Claims (1)
チングして形成したクリアランス状マークと、前
記マークに対応する裏面に銅層を相似形に残し且
つ寸法を変えて形成した複数個のマークとを透明
基板本体に有することを特徴とする印刷配線基板
。 Clearance-like marks formed by etching a copper layer at a plurality of spaced locations on one surface, and multiple marks formed by leaving a copper layer in a similar shape and changing dimensions on the back surface corresponding to the marks. A printed wiring board characterized by having a transparent substrate body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4890287U JPS63155668U (en) | 1987-03-30 | 1987-03-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4890287U JPS63155668U (en) | 1987-03-30 | 1987-03-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63155668U true JPS63155668U (en) | 1988-10-12 |
Family
ID=30870868
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4890287U Pending JPS63155668U (en) | 1987-03-30 | 1987-03-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63155668U (en) |
-
1987
- 1987-03-30 JP JP4890287U patent/JPS63155668U/ja active Pending