JPH0231170U - - Google Patents
Info
- Publication number
- JPH0231170U JPH0231170U JP10891688U JP10891688U JPH0231170U JP H0231170 U JPH0231170 U JP H0231170U JP 10891688 U JP10891688 U JP 10891688U JP 10891688 U JP10891688 U JP 10891688U JP H0231170 U JPH0231170 U JP H0231170U
- Authority
- JP
- Japan
- Prior art keywords
- base material
- integrated circuit
- printed
- hybrid integrated
- substrate base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 2
Description
第１図は本考案に係る混成集積回路用基板を示
す平面図、第２図は要部を拡大して示す平面図で
ある。
１……基板母材、２……基板本体、３……導体
パターン、４……ブレイク溝、５……位置決め用
マーク、５ａ……指示用辺。
FIG. 1 is a plan view showing a hybrid integrated circuit board according to the present invention, and FIG. 2 is a plan view showing an enlarged main part. DESCRIPTION OF SYMBOLS 1... Board base material, 2... Board body, 3... Conductor pattern, 4... Break groove, 5... Positioning mark, 5a... Indication side.
Claims (1)
ク溝に沿つて複数枚に分断形成される混成集積回
路用基板において、前記基板母材上に、前記ブレ
イク溝を指示する指針部を有する位置決め用マー
クを導体部印刷時に同時に複数印刷したことを特
徴とする混成集積回路用基板。 In a hybrid integrated circuit board that is formed by dividing a substrate base material on which a wiring pattern is printed into a plurality of sheets along break grooves, a positioning mark having a pointer portion indicating the break groove is provided on the substrate base material. A board for a hybrid integrated circuit, characterized in that a plurality of conductor parts are printed at the same time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10891688U JPH0231170U (en) | 1988-08-19 | 1988-08-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10891688U JPH0231170U (en) | 1988-08-19 | 1988-08-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0231170U true JPH0231170U (en) | 1990-02-27 |
Family
ID=31344695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10891688U Pending JPH0231170U (en) | 1988-08-19 | 1988-08-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0231170U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05145215A (en) * | 1991-11-19 | 1993-06-11 | Taiyo Yuden Co Ltd | Formation of parts-positioning mark for printed wiring board |
| JP2012146779A (en) * | 2011-01-11 | 2012-08-02 | Yazaki Corp | Alignment structure of substrate and mask |
-
1988
- 1988-08-19 JP JP10891688U patent/JPH0231170U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05145215A (en) * | 1991-11-19 | 1993-06-11 | Taiyo Yuden Co Ltd | Formation of parts-positioning mark for printed wiring board |
| JP2012146779A (en) * | 2011-01-11 | 2012-08-02 | Yazaki Corp | Alignment structure of substrate and mask |