JPH0291365U - - Google Patents
Info
- Publication number
- JPH0291365U JPH0291365U JP29389U JP29389U JPH0291365U JP H0291365 U JPH0291365 U JP H0291365U JP 29389 U JP29389 U JP 29389U JP 29389 U JP29389 U JP 29389U JP H0291365 U JPH0291365 U JP H0291365U
- Authority
- JP
- Japan
- Prior art keywords
- wiring pattern
- pattern made
- printed board
- copper foil
- conductive ink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims description 5
Landscapes
- Structure Of Printed Boards (AREA)
Description
第1図は本案プリント板の1例の断面図、第2
図は幅狭部を有するプリント板の平面図、第3図
は第2図の―線で截断した拡大断面図である
。
1…ベースフイルム、2…オーバーレイフイル
ム、3…銅箔、4…導電インク。
Figure 1 is a cross-sectional view of one example of the printed board in the present case, Figure 2
The figure is a plan view of a printed circuit board having a narrow portion, and FIG. 3 is an enlarged cross-sectional view taken along the line ``--'' in FIG. 1... Base film, 2... Overlay film, 3... Copper foil, 4... Conductive ink.
Claims (1)
配線パターンとを混在させて形成したことを特徴
とするフレキシブルプリント板。 2 銅箔による配線パターンで共通回路部分を構
成し、導電インクによる配線パターンで仕様別回
路部分を構成したことを特徴とする請求項1記載
のフレキシブルプリント板。 3 ベースフイルムとオーバーレイフイルムとか
ら成るフレキシブルプリント板であつて、該ベー
スフイルム上に銅箔による配線パターン又は銅箔
よる配線パターンと導電インクによる配線パター
ンとが混在した配線パターンを形成すると共に、
該プリント板の幅狭部を通る複数本の配線の一部
を該幅狭部においてオーバーレイフイルム上又は
ベースフイルムの裏面に導電インクによつて形成
したことを特徴とするフレキシブルプリント板。[Claims for Utility Model Registration] 1. A flexible printed board characterized by forming a wiring pattern made of copper foil and a wiring pattern made of conductive ink. 2. The flexible printed board according to claim 1, wherein the common circuit portion is formed by a wiring pattern made of copper foil, and the specification-specific circuit portion is formed by a wiring pattern made of conductive ink. 3. A flexible printed board consisting of a base film and an overlay film, in which a wiring pattern made of copper foil or a wiring pattern in which a wiring pattern made of copper foil and a wiring pattern made of conductive ink are mixed is formed on the base film, and
A flexible printed board, characterized in that a part of a plurality of wires passing through the narrow portion of the printed board is formed in the narrow portion on an overlay film or on the back surface of a base film using conductive ink.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29389U JPH079413Y2 (en) | 1989-01-07 | 1989-01-07 | Flexible printed board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29389U JPH079413Y2 (en) | 1989-01-07 | 1989-01-07 | Flexible printed board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0291365U true JPH0291365U (en) | 1990-07-19 |
JPH079413Y2 JPH079413Y2 (en) | 1995-03-06 |
Family
ID=31199191
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP29389U Expired - Lifetime JPH079413Y2 (en) | 1989-01-07 | 1989-01-07 | Flexible printed board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH079413Y2 (en) |
-
1989
- 1989-01-07 JP JP29389U patent/JPH079413Y2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH079413Y2 (en) | 1995-03-06 |