JPH0291365U - - Google Patents

Info

Publication number
JPH0291365U
JPH0291365U JP29389U JP29389U JPH0291365U JP H0291365 U JPH0291365 U JP H0291365U JP 29389 U JP29389 U JP 29389U JP 29389 U JP29389 U JP 29389U JP H0291365 U JPH0291365 U JP H0291365U
Authority
JP
Japan
Prior art keywords
wiring pattern
pattern made
printed board
copper foil
conductive ink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP29389U
Other languages
Japanese (ja)
Other versions
JPH079413Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP29389U priority Critical patent/JPH079413Y2/en
Publication of JPH0291365U publication Critical patent/JPH0291365U/ja
Application granted granted Critical
Publication of JPH079413Y2 publication Critical patent/JPH079413Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本案プリント板の1例の断面図、第2
図は幅狭部を有するプリント板の平面図、第3図
は第2図の―線で截断した拡大断面図である
。 1…ベースフイルム、2…オーバーレイフイル
ム、3…銅箔、4…導電インク。
Figure 1 is a cross-sectional view of one example of the printed board in the present case, Figure 2
The figure is a plan view of a printed circuit board having a narrow portion, and FIG. 3 is an enlarged cross-sectional view taken along the line ``--'' in FIG. 1... Base film, 2... Overlay film, 3... Copper foil, 4... Conductive ink.

Claims (1)

【実用新案登録請求の範囲】 1 銅箔による配線パターンと導電インクによる
配線パターンとを混在させて形成したことを特徴
とするフレキシブルプリント板。 2 銅箔による配線パターンで共通回路部分を構
成し、導電インクによる配線パターンで仕様別回
路部分を構成したことを特徴とする請求項1記載
のフレキシブルプリント板。 3 ベースフイルムとオーバーレイフイルムとか
ら成るフレキシブルプリント板であつて、該ベー
スフイルム上に銅箔による配線パターン又は銅箔
よる配線パターンと導電インクによる配線パター
ンとが混在した配線パターンを形成すると共に、
該プリント板の幅狭部を通る複数本の配線の一部
を該幅狭部においてオーバーレイフイルム上又は
ベースフイルムの裏面に導電インクによつて形成
したことを特徴とするフレキシブルプリント板。
[Claims for Utility Model Registration] 1. A flexible printed board characterized by forming a wiring pattern made of copper foil and a wiring pattern made of conductive ink. 2. The flexible printed board according to claim 1, wherein the common circuit portion is formed by a wiring pattern made of copper foil, and the specification-specific circuit portion is formed by a wiring pattern made of conductive ink. 3. A flexible printed board consisting of a base film and an overlay film, in which a wiring pattern made of copper foil or a wiring pattern in which a wiring pattern made of copper foil and a wiring pattern made of conductive ink are mixed is formed on the base film, and
A flexible printed board, characterized in that a part of a plurality of wires passing through the narrow portion of the printed board is formed in the narrow portion on an overlay film or on the back surface of a base film using conductive ink.
JP29389U 1989-01-07 1989-01-07 Flexible printed board Expired - Lifetime JPH079413Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29389U JPH079413Y2 (en) 1989-01-07 1989-01-07 Flexible printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29389U JPH079413Y2 (en) 1989-01-07 1989-01-07 Flexible printed board

Publications (2)

Publication Number Publication Date
JPH0291365U true JPH0291365U (en) 1990-07-19
JPH079413Y2 JPH079413Y2 (en) 1995-03-06

Family

ID=31199191

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29389U Expired - Lifetime JPH079413Y2 (en) 1989-01-07 1989-01-07 Flexible printed board

Country Status (1)

Country Link
JP (1) JPH079413Y2 (en)

Also Published As

Publication number Publication date
JPH079413Y2 (en) 1995-03-06

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