JPS63167773U - - Google Patents
Info
- Publication number
- JPS63167773U JPS63167773U JP6180887U JP6180887U JPS63167773U JP S63167773 U JPS63167773 U JP S63167773U JP 6180887 U JP6180887 U JP 6180887U JP 6180887 U JP6180887 U JP 6180887U JP S63167773 U JPS63167773 U JP S63167773U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- areas
- utility
- base substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Description
第１図はこの考案の一実施例を示す斜視図、第
２図は第１図の―線の断面図、第３図は従来
の印刷配線板の斜視図である。
図中、１は印刷配線板、２は導体パターン、３
は電気素子、６ａ〜６ｄはバーリング穴である。
尚、図中同一符号は同一又は相当部分を示す。
FIG. 1 is a perspective view showing an embodiment of this invention, FIG. 2 is a sectional view taken along the line -- in FIG. 1, and FIG. 3 is a perspective view of a conventional printed wiring board. In the figure, 1 is a printed wiring board, 2 is a conductor pattern, and 3
is an electric element, and 6a to 6d are burring holes. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
ーンや電気素子のない箇所に１個または複数個の
バーリング穴を設けたことを特徴とする印刷配線
板。 1. A printed wiring board made of a metal base substrate, characterized in that one or more burring holes are provided in areas where there are no conductor patterns or electric elements.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6180887U JPS63167773U (en) | 1987-04-22 | 1987-04-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6180887U JPS63167773U (en) | 1987-04-22 | 1987-04-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63167773U true JPS63167773U (en) | 1988-11-01 |
Family
ID=30895481
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6180887U Pending JPS63167773U (en) | 1987-04-22 | 1987-04-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63167773U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018536976A (en) * | 2015-12-08 | 2018-12-13 | フィリップス ライティング ホールディング ビー ヴィ | Assembly and lighting device having assembly |
| WO2023095517A1 (en) * | 2021-11-24 | 2023-06-01 | サンデン株式会社 | Heat medium heating device |
-
1987
- 1987-04-22 JP JP6180887U patent/JPS63167773U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018536976A (en) * | 2015-12-08 | 2018-12-13 | フィリップス ライティング ホールディング ビー ヴィ | Assembly and lighting device having assembly |
| WO2023095517A1 (en) * | 2021-11-24 | 2023-06-01 | サンデン株式会社 | Heat medium heating device |