JPS62124873U - - Google Patents
Info
- Publication number
- JPS62124873U JPS62124873U JP14910885U JP14910885U JPS62124873U JP S62124873 U JPS62124873 U JP S62124873U JP 14910885 U JP14910885 U JP 14910885U JP 14910885 U JP14910885 U JP 14910885U JP S62124873 U JPS62124873 U JP S62124873U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- ceramic
- copper foil
- ceramic circuit
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000011889 copper foil Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000011888 foil Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Waveguide Connection Structure (AREA)
- Waveguides (AREA)
Description
第１図はこの考案の一実施例に係るセラミツク
回路基板を示す斜視図、第２図は第１図のＡ―Ａ
から見た断面図、第３図ａ，ｂはこの考案の他の
実施例に係るセラミツク回路基板を示す詳細図、
第４図及び第５図はそれぞれ従来のセラミツク回
路基板を示す斜視図、第６図は第５図のＡ―Ａか
ら見た断面図である。
１０……セラミツク基板、１１……角孔、１２
……銅箔、１３……回路パターン、１４，１５…
…第１及び第２の溝部、１６……金属箔、１７…
…筐体、１８……破断部。
Fig. 1 is a perspective view showing a ceramic circuit board according to an embodiment of this invention, and Fig. 2 is an A-A of Fig. 1.
3a and 3b are detailed views showing a ceramic circuit board according to another embodiment of this invention,
4 and 5 are perspective views showing conventional ceramic circuit boards, respectively, and FIG. 6 is a sectional view taken along line AA in FIG. 5. 10... Ceramic substrate, 11... Square hole, 12
...Copper foil, 13...Circuit pattern, 14,15...
...first and second grooves, 16...metal foil, 17...
...Casing, 18...Broken part.
Claims (1)
１本以上の溝部が設けられたセラミツク基板を具
備したことを特徴とするセラミツク回路基板。 1. A ceramic circuit board comprising a ceramic substrate coated with copper foil on one side and provided with at least one groove on the other side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14910885U JPS62124873U (en) | 1985-09-30 | 1985-09-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14910885U JPS62124873U (en) | 1985-09-30 | 1985-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62124873U true JPS62124873U (en) | 1987-08-08 |
Family
ID=31064004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14910885U Pending JPS62124873U (en) | 1985-09-30 | 1985-09-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62124873U (en) |
-
1985
- 1985-09-30 JP JP14910885U patent/JPS62124873U/ja active Pending