JPS62124873U - - Google Patents

Info

Publication number
JPS62124873U
JPS62124873U JP14910885U JP14910885U JPS62124873U JP S62124873 U JPS62124873 U JP S62124873U JP 14910885 U JP14910885 U JP 14910885U JP 14910885 U JP14910885 U JP 14910885U JP S62124873 U JPS62124873 U JP S62124873U
Authority
JP
Japan
Prior art keywords
circuit board
ceramic
copper foil
ceramic circuit
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14910885U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14910885U priority Critical patent/JPS62124873U/ja
Publication of JPS62124873U publication Critical patent/JPS62124873U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Waveguides (AREA)
  • Structure Of Printed Boards (AREA)
  • Waveguide Connection Structure (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの考案の一実施例に係るセラミツク
回路基板を示す斜視図、第2図は第1図のA―A
から見た断面図、第3図a,bはこの考案の他の
実施例に係るセラミツク回路基板を示す詳細図、
第4図及び第5図はそれぞれ従来のセラミツク回
路基板を示す斜視図、第6図は第5図のA―Aか
ら見た断面図である。 10……セラミツク基板、11……角孔、12
……銅箔、13……回路パターン、14,15…
…第1及び第2の溝部、16……金属箔、17…
…筐体、18……破断部。
Fig. 1 is a perspective view showing a ceramic circuit board according to an embodiment of this invention, and Fig. 2 is an A-A of Fig. 1.
3a and 3b are detailed views showing a ceramic circuit board according to another embodiment of this invention,
4 and 5 are perspective views showing conventional ceramic circuit boards, respectively, and FIG. 6 is a sectional view taken along line AA in FIG. 5. 10... Ceramic substrate, 11... Square hole, 12
...Copper foil, 13...Circuit pattern, 14,15...
...first and second grooves, 16...metal foil, 17...
...Casing, 18...Broken part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 一方面に銅箔が被着され、他方面に少なくとも
1本以上の溝部が設けられたセラミツク基板を具
備したことを特徴とするセラミツク回路基板。
1. A ceramic circuit board comprising a ceramic substrate coated with copper foil on one side and provided with at least one groove on the other side.
JP14910885U 1985-09-30 1985-09-30 Pending JPS62124873U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14910885U JPS62124873U (en) 1985-09-30 1985-09-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14910885U JPS62124873U (en) 1985-09-30 1985-09-30

Publications (1)

Publication Number Publication Date
JPS62124873U true JPS62124873U (en) 1987-08-08

Family

ID=31064004

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14910885U Pending JPS62124873U (en) 1985-09-30 1985-09-30

Country Status (1)

Country Link
JP (1) JPS62124873U (en)

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