JPH0336162U - - Google Patents
Info
- Publication number
- JPH0336162U JPH0336162U JP9595289U JP9595289U JPH0336162U JP H0336162 U JPH0336162 U JP H0336162U JP 9595289 U JP9595289 U JP 9595289U JP 9595289 U JP9595289 U JP 9595289U JP H0336162 U JPH0336162 U JP H0336162U
- Authority
- JP
- Japan
- Prior art keywords
- individual
- circuit
- boards
- printed wiring
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000011889 copper foil Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図ａ，ｂは本考案の一実施例によるプリン
ト配線板及び個片基板を示す斜視図及び平面図、
第２図は同プリント配線板の位置合せマークの拡
大図、第３図ａ，ｂは従来のプリント配線板及び
個片基板の斜視図及び平面図である。
１……個片基板、２……配線パターン、３……
余白部、４……プリント配線板、６……分割加工
ライン、１５……位置合せマーク、１７，１８…
…マーク。
FIGS. 1a and 1b are a perspective view and a plan view showing a printed wiring board and an individual board according to an embodiment of the present invention,
FIG. 2 is an enlarged view of alignment marks on the printed wiring board, and FIGS. 3a and 3b are a perspective view and a plan view of a conventional printed wiring board and individual circuit boards. 1...Individual board, 2...Wiring pattern, 3...
Margin area, 4...Printed wiring board, 6...Dividing processing line, 15...Alignment mark, 17, 18...
…mark.
Claims (1)
させた状態で設けるとともに、前記個片基板を多
数個配列させた周囲に配線パターンを形成しない
余白部を設け、かつ前記余白部に個片基板と個片
基板の接続ラインをセンターとした分割用の位置
基準の位置合せマークを銅箔にて左右、または上
下対称に形成したプリント配線板。 (2) 位置合せマークを、四角形と三角形の組合
せにより構成した請求項１に記載のプリント配線
板。[Claims for Utility Model Registration] (1) A large number of individual circuit boards to be divided into one circuit are arranged in an array, and a blank area where no wiring pattern is formed around the plurality of individual board boards arranged. , and in which alignment marks are formed in the margin portions to serve as positional standards for dividing with the connection line between the individual substrates as the center, which are symmetrically formed laterally or vertically using copper foil. (2) The printed wiring board according to claim 1, wherein the alignment mark is composed of a combination of squares and triangles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9595289U JPH0336162U (en) | 1989-08-16 | 1989-08-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9595289U JPH0336162U (en) | 1989-08-16 | 1989-08-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0336162U true JPH0336162U (en) | 1991-04-09 |
Family
ID=31645183
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9595289U Pending JPH0336162U (en) | 1989-08-16 | 1989-08-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0336162U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4721926B2 (en) * | 2005-06-28 | 2011-07-13 | 京セラ株式会社 | Multiple wiring board |
-
1989
- 1989-08-16 JP JP9595289U patent/JPH0336162U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4721926B2 (en) * | 2005-06-28 | 2011-07-13 | 京セラ株式会社 | Multiple wiring board |