JPH01169062U - - Google Patents
Info
- Publication number
- JPH01169062U JPH01169062U JP6558088U JP6558088U JPH01169062U JP H01169062 U JPH01169062 U JP H01169062U JP 6558088 U JP6558088 U JP 6558088U JP 6558088 U JP6558088 U JP 6558088U JP H01169062 U JPH01169062 U JP H01169062U
- Authority
- JP
- Japan
- Prior art keywords
- land
- circuit board
- printed circuit
- printing
- portion formed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第1図は、本考案のプリント基板の部品マーク
の要部を示す拡大断面図、第2図は、プリント基
板の表面側の部品実装面の一部の表面図、第3図
は、プリント基板の裏側面のハンダ面の一部の裏
面図、第4図は、既に提案されているプリント基
板の部品マークを示す断面図、第5図は、第4図
中の鎖円A部の拡大断面図、第6図は、同上平面
図である。
1…プリント基板、3…プリント回路、4…ス
ルーホール、5…ランド部材、5a,5b…ラン
ド部、8…ハンダ部、9…第1シルク印刷部、1
0…第2シルク印刷部。
Figure 1 is an enlarged sectional view showing the main part of the component mark of the printed circuit board of the present invention, Figure 2 is a surface view of a part of the component mounting surface on the front side of the printed circuit board, and Figure 3 is the printed circuit board. Figure 4 is a cross-sectional view showing the parts mark of the printed circuit board that has already been proposed, and Figure 5 is an enlarged cross-section of chain circle A in Figure 4. FIG. 6 is a plan view of the same as above. DESCRIPTION OF SYMBOLS 1... Printed circuit board, 3... Printed circuit, 4... Through hole, 5... Land member, 5a, 5b... Land part, 8... Solder part, 9... First silk printing part, 1
0...Second silk printing department.
Claims (1)
ホールを有するランド部材と、上記プリント基板
の表面側の部品実装面における上記ランド部材の
ランド面の一部に掛かるように印刷して形成した
第一印刷部と、上記プリント基板の裏面側のハン
ダ面における上記ランド部材のランド面に僅かに
間隙を存して印刷して形成した第2印刷部とより
なるプリント基板の部品マーク。 A land member having a through hole made of a conductive material attached to a printed circuit board, and a first printed portion formed by printing so as to overlap a part of the land surface of the land member on the component mounting surface on the front side of the printed circuit board. and a second printed portion formed by printing on the land surface of the land member on the solder surface on the back side of the printed circuit board with a slight gap.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6558088U JPH062288Y2 (en) | 1988-05-18 | 1988-05-18 | Printed circuit board component mark |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6558088U JPH062288Y2 (en) | 1988-05-18 | 1988-05-18 | Printed circuit board component mark |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01169062U true JPH01169062U (en) | 1989-11-29 |
JPH062288Y2 JPH062288Y2 (en) | 1994-01-19 |
Family
ID=31291013
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6558088U Expired - Lifetime JPH062288Y2 (en) | 1988-05-18 | 1988-05-18 | Printed circuit board component mark |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH062288Y2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012099671A (en) * | 2010-11-02 | 2012-05-24 | Sumitomo Wiring Syst Ltd | Mount substrate |
JP2012104572A (en) * | 2010-11-08 | 2012-05-31 | Sumitomo Wiring Syst Ltd | Mount substrate |
-
1988
- 1988-05-18 JP JP6558088U patent/JPH062288Y2/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012099671A (en) * | 2010-11-02 | 2012-05-24 | Sumitomo Wiring Syst Ltd | Mount substrate |
JP2012104572A (en) * | 2010-11-08 | 2012-05-31 | Sumitomo Wiring Syst Ltd | Mount substrate |
Also Published As
Publication number | Publication date |
---|---|
JPH062288Y2 (en) | 1994-01-19 |