JPS62180970U - - Google Patents
Info
- Publication number
- JPS62180970U JPS62180970U JP6891186U JP6891186U JPS62180970U JP S62180970 U JPS62180970 U JP S62180970U JP 6891186 U JP6891186 U JP 6891186U JP 6891186 U JP6891186 U JP 6891186U JP S62180970 U JPS62180970 U JP S62180970U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- board
- hole
- base board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Description
第１図は、本考案のプリント配線板の接合構造
の実施例を示す要部の図で、ａは断面図、ｂは平
面図。第２図は、従来のプリント配線基板の接合
構造を示す要部の図。
１……プリント配線基板、２……断面スルーホ
ール部、３……ベース基板、４……ハンダ付けパ
ターン部、５……ベース基板穴。
FIG. 1 is a diagram of a main part showing an embodiment of a bonding structure for a printed wiring board according to the present invention, in which a is a cross-sectional view and b is a plan view. FIG. 2 is a diagram of main parts showing a conventional printed wiring board bonding structure. DESCRIPTION OF SYMBOLS 1... Printed wiring board, 2... Cross-sectional through-hole portion, 3... Base board, 4... Soldering pattern part, 5... Base board hole.
Claims (1)
板と前記プリント配線基板がハンダ付けされるパ
ターンを形成した、ベース基板とを有し、前記ベ
ース基板の前記プリント配線基板と重なる接合部
分に穴もしくはサライを設けたことを特徴とする
プリント配線基板の接合構造。 A printed wiring board having a through hole formed in its cross section and a base board having a pattern to which the printed wiring board is soldered, wherein a hole or a groove is provided in a joint portion of the base board that overlaps with the printed wiring board. A printed wiring board bonding structure characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6891186U JPS62180970U (en) | 1986-05-08 | 1986-05-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6891186U JPS62180970U (en) | 1986-05-08 | 1986-05-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62180970U true JPS62180970U (en) | 1987-11-17 |
Family
ID=30909159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6891186U Pending JPS62180970U (en) | 1986-05-08 | 1986-05-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62180970U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009131204A1 (en) * | 2008-04-24 | 2009-10-29 | 日本電気株式会社 | Substrate, structure for mounting surface mounting component, and electronic device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60227492A (en) * | 1984-04-25 | 1985-11-12 | 松下電工株式会社 | Electronic circuit block |
-
1986
- 1986-05-08 JP JP6891186U patent/JPS62180970U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60227492A (en) * | 1984-04-25 | 1985-11-12 | 松下電工株式会社 | Electronic circuit block |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009131204A1 (en) * | 2008-04-24 | 2009-10-29 | 日本電気株式会社 | Substrate, structure for mounting surface mounting component, and electronic device |
| JPWO2009131204A1 (en) * | 2008-04-24 | 2011-08-25 | 日本電気株式会社 | Substrate, surface mount component mounting structure, and electronic device |