JPS60227492A - Electronic circuit block - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to an electronic circuit block on which semiconductor elements, electronic components, etc. can be mounted. [Background technology] In conventional printed wiring, electronic circuit blocks in which semiconductor elements and electronic components are mixedly mounted on an electric circuit board are generally manufactured by first fixing and sealing the semiconductor elements using wire bonds and wire bonds. It is formed by attaching other electronic components to the same board using solder or the like.

The problems in this case are as follows. (2) Since it is difficult to maintain the sealing resin of a semiconductor element in a fixed shape while sealing, sealing reliability such as moisture resistance becomes unstable. ■
When the electric circuit board is large, due to the influence of board warpage,
Bonding reliability of semiconductor elements is lacking. ■ Since the bonding and sealing processes generally involve heating, the conductor (usually copper foil) of the electrical circuit board is oxidized, which reduces the soldering properties of electronic components in the subsequent process.

[Object of the Invention] The present invention aims to provide an electronic circuit block with improved reliability in encapsulating semiconductor elements.

[Disclosure of the invention] The electronic circuit block according to this invention is
As shown in the figure, in an electronic circuit block in which a semiconductor element (1) and an electronic component (■) are mixedly mounted, the semiconductor element (1)
) is mounted by wire bonding, die bonding, etc. on a small electric circuit board (small board) (4) that is separate from the electric circuit board (mother board 3) on which other electronic components (2) are also mounted, and , a hole (6) is made in the mother board (3), and the small board (4)
The semiconductor element (1) to be mounted thereon is placed in the aperture hole (6), and the respective electrodes (7) and (8) are connected face-down to the block.

The manufacturing process of the electronic circuit block according to the present invention is as follows.

A semiconductor element (1) is mounted on a small substrate (4) by die bonding or wire bonding.

The electrode (7) on the periphery of the small substrate (4) is bonded face-down to a predetermined electrode 8) on the periphery of the hole (6) on the mother substrate (3) that can contain the semiconductor element (1). in the form of
Solder together with other electronic components (2).

Then, reverse the mother board (3) and place the mother board (3) as described above.
A finished product is obtained by injecting the sealing resin (5) into the upper hole (6) and curing it by heating to seal the semiconductor element.

[Effects of the Invention] As described above, according to the electronic circuit block of the present invention, the hole (6) of the mother board (3) can be used to harden the sealing resin (51) to a constant thickness and shape. This makes it possible to improve the sealing reliability of the semiconductor element (1).

The small substrate (4) on which the semiconductor element (1) is mounted can be formed small, is less affected by warpage of the mother substrate (3), and bonding reliability is improved.

Since the small substrate (4) on which the semiconductor element (1) is mounted is mounted on the motherboard (3) in a face-down manner, it can be formed using a single-sided electric circuit board, and can be manufactured economically.

[Brief explanation of drawings]

1 to 3 are views showing one embodiment of the present invention, in which FIGS. 1 and 2 are perspective views, and FIG. 3 is a sectional view.

Claims (1)

[Claims] (11 is an electronic circuit block on which semiconductor elements (1) and electronic components <2) are mixedly mounted, and an electric circuit board (mother board) (3) on which semiconductor elements (11 is other electronic components) is also mounted. ) A small electric circuit board (small board) (4)
On the other hand, a hole (6) is made in the mother board (3), and the semiconductor element (1) to be mounted on the small board (4) is inserted into the chain hole (67), and each Connect the electrodes (71, (81) face down.