JPH06216492A - Electronic device - Google Patents

Abstract

PURPOSE:To obtain an electronic device wherein the packaging density of an electronic component in a wiring board is high by a method wherein the electronic component is mounted in a through hole and on a film board having a wiring board structure closing the through hole. CONSTITUTION:A through hole 4 is formed at a desired part in a wiring board 1, film boards 5, 6 are pasted on the surface and the back of the wiring board 1 so as to close it. Solders 12 are formed on desired surfaces of wiring layers 10, and they are bonded to wiring layers 2 on the wiring board 1. Thereby, the film boards 5, 6 are pasted on the wiring board 1 so as to close the through hole 4. Then, a semiconductor chip 7 is fixed, via a silver paste 16, to a chip mounting pad 5 formed of the wiring layer 10 on the surface of the film board 6 inside the through hole 4, and its electrodes and the desired wiring layer 10 on the surface of the film board 6 are connected electrically by wires 17. Consequently, the through hole is closed by the film boards composed of a wiring board structure, and an electronic component is mounted on the film board inside the through hole. Consequently, the packaging density of the electronic component can be enhanced.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device, for example, an electronic device such as a hybrid integrated circuit device in which a large number of electronic components are mounted on a wiring board.

[0002]

2. Description of the Related Art In a semiconductor device such as a transistor or a diode, or a semiconductor device such as an IC (integrated circuit device) or an LSI (large-scale integrated circuit device), its package form is an insertion type depending on a form mounted on a wiring board. And surface mount type (surface mount type). For example, March 1988 issue of "Plastics" issued by the Industrial Research Board, issued on March 1, 1988,
The types of semiconductor packages and typical package appearances are shown in P78 to P84. A typical package is a plastic DIP (Dual Inline Packag).
e), plastic SIP (Single Inline Package), plastic flat, PLCC (Plastic Leaded Chip)
Carrier), hermetic seal, cerdip, pin grid array, ceramic DIP, ceramic flat, LCC (Leadless Chip Carrier), and plastic mold.

On the other hand, electronic devices are required to have high-density mounting in terms of functions, and to be lightweight, downsized, and thin in terms of mounting. Further, in order to reduce the manufacturing cost of electronic components, a resin package (plastic package) made of a resin (resin) that is inexpensive and has high productivity is often used as a package form. The small and thin packages are described in "Hitachi Hyoron", No. 3, 1992, issued by Hitachi Hyoronsha, March 75, 1992, P75 to P80. This document describes TSO as a smaller and thinner package.
P (Thin Small Outline Package), SSOP (Shrink
Small Outline Package, TQFP (Thin Quad Flat)
Package), STZIP (Shrink ThinZigzag Inline Pa
ckage) is disclosed. In addition, SOP (Small Outline
Package) has outer leads on two sides of the package, and QFP (Thin Quad Flat Package) has outer leads on the four sides of the package. The TSOP and TQFP are made of a resin (plastic) package having a body thickness of 1 mm. In addition, Nikkei BP's "Nikkei Micro Device" 19
Issued on February 1, 1991, February 1, the same year. P65 contains TAB (Ta
pe Automated Bonding) has been introduced, and a thin package with a package thickness of 0.5 mm has been introduced.

Also, "Nikkei Microdevice", February 1989, published by Nikkei BP, published February 1, 1989, P15 introduces a double-sided TAB tape having copper foils on both sides.
The through hole of this TAB tape has a diameter of 50 μm.

On the other hand, "Electronic Materials" issued by the Industrial Research Institute, September 1984 issue, issued September 1, 1984, P64 shows (a) J as the type of terminal shape in a general flat package.
Rolled-under, (b) Gull wing
-Wing), (c) Butt-lead, and (d) Flat lead.

In addition, the "Electronic Materials" issued by the Industrial Research Institute, July 1987 issue, July 1, the same year, P115-P120, insert the chip component (Melph component) vertically into the through hole of the printed circuit board. There is disclosed a mounting structure (chip-in-board) in which a printed circuit board is assembled by accommodating the components and conductively connecting the chip component and the pattern by a double-sided pattern.

[0007]

In an electronic circuit using a multilayer printed circuit board, many parts are mounted on the front and back surfaces of the printed circuit board. However, in the structure in which electronic components are mounted on the front and back surfaces of the wiring board, the wiring pattern area increases due to the wiring of the electrode surfaces (lands, etc.) connecting the electrode parts of the electronic components and the wiring (wiring layer) connected to these electrode surfaces. Therefore, there is a limit in improving the packaging density in a limited space. Therefore, conventionally, as shown in the above-mentioned document, a structure in which a through hole is provided in a printed board and a melf component is inserted into the through hole has been developed. The present invention also relates to the technology of the idea of mounting an electronic component in the through hole of the wiring board.

An object of the present invention is to provide an electronic device having a high mounting density of electronic components on a wiring board. The above and other objects and novel features of the present invention will be apparent from the description of the present specification and the accompanying drawings.

[0009]

The outline of the representative ones of the inventions disclosed in the present application will be briefly described as follows. That is, the electronic device of the present invention is an electronic device in which an electronic component is mounted in a through hole provided in a wiring board, and an electronic circuit is formed between the wiring board and both surfaces of the wiring board. A film substrate having a wiring substrate structure that is electrically connected is attached. A semiconductor chip is fixed to the film substrate in the through hole, the electrodes of the semiconductor chip and the conductor layer of the film substrate are electrically connected by a conductive wire, and the semiconductor chip, the wire, and the like are made of resin. It is sealed with. Also,
Electronic components are mounted on the film substrate portion that closes the through holes of the wiring substrate.

An electronic device according to another embodiment of the present invention is an electronic device in which electronic parts are mounted in through holes provided in a wiring board, and an electronic device is provided between the wiring board and both sides of the wiring board. A film substrate of a wiring substrate structure is attached, which is electrically connected to form a circuit. The electronic component inserted into the through hole of the wiring board is provided with a plurality of electrode terminals on its peripheral surface. These electrode terminals are electrically connected to a wiring layer provided on the side wall of the through hole via a bonding material. Electronic parts are mounted on the film substrate portion that closes the through holes of the wiring substrate.

In an electronic device according to another embodiment of the present invention, a package portion of an electronic component is inserted into a through hole provided in a wiring board, and leads (electrode terminals) protruding from the peripheral surface of the package are wired on the wiring board. The structure is such that the layers are electrically connected via a bonding material. Then, for example, the packages of two electronic components are vertically stacked and inserted into the through hole, the leads of the upper electronic component are electrically connected to the wiring layer on the upper surface of the wiring board, and the leads of the lower electronic component are connected. Are electrically connected to the wiring layer on the lower surface of the wiring board. In addition, electronic components are arranged and mounted outside the through holes so as to straddle the electronic components inserted in the through holes.

[0012]

In the electronic device of the present invention, the electronic parts are mounted in the through holes provided in the wiring board, and the electronic parts are also mounted on the film substrate of the wiring board structure that closes the through holes. , Mounting density is improved.

In the structure of inserting the package of the electronic component into the through hole of the wiring board according to another embodiment of the present invention, the package portion is inserted into the through hole, and the other portion is formed by straddling the through hole portion. The mounting density can be improved by mounting the electronic components. In particular, when two electronic component packages are superposedly inserted into one through hole, the mounting density becomes higher.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view showing a main part of an electronic device according to an embodiment of the present invention, FIGS. 2 to 5 are views showing respective steps of manufacturing the electronic device of the present invention, and FIG. 2 is a basic member for assembling the electronic device. FIG. 3 is a cross-sectional view showing a wiring board to be a wiring board, FIG. 3 is a cross-sectional view showing a state where a film board is attached to the lower surface of the wiring board, and FIG. FIG. 5 is a sectional view showing a stopped state, and FIG. 5 is a sectional view showing a state in which a film substrate is attached to an upper surface of the wiring substrate.

The electronic device of the present invention is an electronic device having a hybrid integrated circuit structure in which a plurality of electronic components are mounted on a wiring board. FIG. 1 is a sectional view showing a main part of an electronic device according to an embodiment of the present invention. Wiring board 1 in the electronic device of the present invention
Is a wiring board having a multilayer structure, and is formed of a printed board made of glass / epoxy resin, a ceramic board, or the like. In this embodiment, for example, the wiring board 1 has three
It has a layered structure, and although not shown, a conductor layer having a desired pattern is provided between the layers. Also, the wiring board 1
The wiring layer 2 is also provided on the front and back surfaces of the. Further, the wiring layer 2 and the conductor layer are electrically connected by a conductor 3 filling a through hole at a desired position. The thickness of the wiring board 1 varies depending on the number of layers forming the wiring board 1 and the like, but is about 1 mm in this embodiment. Wiring board 1
Although not shown, chip parts such as chip capacitors and chip resistors as passive parts are mounted on the front and back surfaces of the IC, and ICs (integrated circuit devices) and L as active parts are mounted.
A semiconductor device such as SI (Large Scale Integrated Circuit Device) is mounted.

On the other hand, this is one of the features of the present invention. Through holes 4 are provided at desired portions of the wiring board 1, and the front and back surfaces of the wiring board 1 are closed so as to close the through holes 4. The film substrates 5 and 6 are attached, and the electronic component, that is, the semiconductor chip 7 is fixed to the film substrate 6 portion on the lower surface side in the through hole 4. The film substrates 5 and 6 have a thickness 7 made of an insulating polyimide resin.
A film 9 having a thickness of 5 to 125 μm, a wiring layer 10 having a thickness of 35 μm provided on the front and back surfaces of the film 9, and a through hole for electrically connecting the wiring layer 10 on the front and back surfaces of the film 9 at predetermined locations are filled. And a conductor 11.
Further, solder 12 is provided on a desired surface portion of the wiring layer 10 of the film substrates 5 and 6. The solder 12 is adhered to the wiring layer 2 of the wiring board 1. As a result, the film substrates 5 and 6 are attached to the wiring substrate 1 so as to close the through holes 4. Therefore, the wiring layer 10 is positioned above and below the through hole 4 due to the presence of the film substrates 5 and 6. The film substrate 5,
6 is provided at a desired portion of the wiring board 1. Since the film 9 is thin and the wiring layer 10 and the solder 12 are each as thin as several tens of μm, the film substrates 5 and 6 are formed.
The portion of the wiring board 1 to which is adhered does not become so thick. The film substrates 5 and 6 may be provided on the entire surface of the wiring substrate 1.

The wiring layer 10 on the upper surface of the film substrate 6 attached to the lower surface of the wiring substrate 1 in the through hole 4 is formed.
The semiconductor chip 7 is fixed to the chip mounting pad 15 formed by using a silver paste 16. Further, an electrode (not shown) of the semiconductor chip 7 and the desired wiring layer 10 on the upper surface of the film substrate 6 are electrically connected by a conductive wire 17. The semiconductor chip 7, the wires 17 and the like are covered with a resin 19 formed by potting. As a result, the electronic component 14 is mounted. The semiconductor chip 7 is 200-40
Since the thickness is about 0 μm, it is mounted on the through hole 4 without protruding.

On the other hand, although many passive components and active components are mounted on the front and back surfaces of the wiring board 1, the film substrates 5 and 6 for closing the through hole 4 are used to form the upper and lower portions of the through hole 4. Also, the electronic component 20 is mounted. The electronic component 20 shown in FIG. 1 is a surface-mounting resin-sealed semiconductor device, and the leads 22 protruding from the peripheral surface of the package 21 are gull-wing type. The electronic component 20 is a TSOP having a package 21 having a thickness of 1.0 mm. This TSOP shows an example in which the lead 22 is mounted on the film substrate 5 portion on the through hole 4 on the upper surface of the wiring substrate 1, and is mounted on the film substrate 6 so as to straddle the through hole 4 on the lower surface of the wiring substrate 1. Here is an example.

Manufacture of an electronic device having such a mounting structure will be described with reference to FIGS. 2 to 5.
As shown in FIG. 2, the wiring board 1 is prepared. This wiring board 1 is a wiring board having a multilayer structure as described above,
It is formed of a printed circuit board made of glass / epoxy resin, a ceramic circuit board, or the like, and has, for example, a three-layer structure, and a conductor layer of a desired pattern is provided between the layers, although not shown. Wiring layers 2 are also provided on the front and back surfaces of the wiring board 1. Further, the wiring layer 2 and the conductor layer are electrically connected by a conductor 3 filling a through hole at a desired position. Although the thickness of the wiring board 1 varies depending on the number of layers constituting the wiring board 1 and the like, it is about 1 mm in this embodiment. Further, a through hole 4 is provided in a desired portion of the wiring board 1. Electronic components are arranged in the through holes 4.

Next, as shown in FIG. 3, a film substrate 6 is attached to the lower surface (back surface) of the wiring board 1.
The film substrate 6 includes a film 9 made of an insulating polyimide resin having a thickness of 75 to 125 μm, a wiring layer 10 having a thickness of 35 μm provided on the front and back surfaces of the film 9, and front and back surfaces of the film 9. And a conductor 11 filled in a through hole for electrically connecting the wiring layer 10 at a predetermined position. In addition, the wiring layer 1 of the film substrate 6
Solder 12 is provided at a desired position on the surface of No. 0. Therefore, when such a film substrate 6 is attached to the lower surface of the wiring substrate 1, the wiring substrate 1 is relatively positioned and superposed on the film substrate 6, and the solder applied to the wiring layer 10 of the film substrate 6 is attached. By remelting 12,
The film substrate 6 is attached to the wiring substrate 1. Although the film substrate 6 is provided locally, it may be provided on the entire surface of the wiring substrate 1.

The film substrate 6 attached to the lower surface of the wiring substrate 1 is provided with the wiring layer 10 and the chip mounting pad 15 formed of the wiring layer 10 on the upper surface side of the through hole 4 side. Therefore, as shown in FIG. 4, the semiconductor chip 7 is fixed to the chip mounting pad 15 with the silver paste 16. The semiconductor chip 7 is fixed with the silver paste 16 by heating the silver paste 16 to 120 to 150 ° C. Next, an electrode (not shown) of the semiconductor chip 7 and the wiring layer 10 of the film substrate 6 are connected by a conductive wire 17. In this wire bonding,
If the distance between the bonding position on the wiring layer 10 and the peripheral wall of the through hole 4 is about 500 μm, the bonding tool will not come into contact with the peripheral wall of the through hole 4. Next, the semiconductor chip 7, the wires 17 and the like are covered with the resin 19 by potting, and the resin 19 is cured and cured.

Next, as shown in FIG. 5, the film substrate 5 is attached to the upper surface of the wiring substrate 1. The film substrate 5 has the same structure as the film substrate 6, except that the wiring layer 10
The wiring patterns of the conductors 11 and the like are not necessarily the same. The film substrate 5 is connected to the wiring substrate 1 by remelting the solder 12 provided in advance on the wiring layer 10 on the lower surface of the film substrate 5 and connecting it to the wiring layer 2 of the wiring substrate 1.

Next, the electronic parts 20 made of TSOP are mounted on the front and back surfaces of the wiring board 1. The electronic component 20 is mounted on the wiring board 1 by remelting the solder 25 previously attached to the leads 22. As a result, a mounting structure as shown in FIG. 1 is formed. Therefore, a desired electronic device is manufactured by incorporating this wiring board 1 into a predetermined package.

[0024]

(1) In the electronic device of the present invention, a through hole is provided in the wiring board, the through hole is closed by a film substrate having a wiring board structure, and electronic parts are mounted on the film substrate in the through hole. As a result, the effect of improving the packaging density can be obtained.

(2) According to the above (1), in the electronic device of the present invention, the wiring substrate is provided with the through hole. Since the through hole is closed by the film substrate, the wiring layer is also provided above and below the through hole. The effect of being able to extend and not hindering the wiring design is obtained.

(3) According to the above (1), in the electronic device of the present invention, the wiring substrate is provided with the through hole. The through hole is closed by the film substrate, and the film substrates above and below the through hole are used. Since the electronic component is mounted by using the electronic component, the effect that the mounting density can be improved can be obtained.

(4) Due to the above (1) to (3), according to the present invention, there is a synergistic effect that it is possible to provide an electronic device which is thin and has a high packing density.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. Needless to say, for example,
In the embodiment, the wiring layer 2 on the front and back surfaces of the wiring substrate 1 and the wiring layer 10 on the front and back surfaces of the film substrates 5 and 6 have an exposed structure, but the desired wiring layers 2 and 10 are covered with an insulating film (insulating film). The structure may be covered with layers.

FIG. 6 is a sectional view showing an essential part of an electronic device according to another embodiment of the present invention. In this embodiment, the wiring layer 2 is provided on the peripheral wall of the through hole 4 provided in the wiring board 1, and the electronic component 31 having the electrode terminal 30 on the peripheral surface is provided in the through hole 4 in the through hole 4. It is a structure to be inserted. The electronic component 31 has a structure in which a semiconductor chip 34 is fixed on a chip mounting pad 33 on the upper surface of an insulating wiring board 32, and the semiconductor chip 34 is also provided.
The electrode (not shown) and the wiring layer 35 on the wiring board 32 are electrically connected by a conductive wire 36. The semiconductor chip 34, wires 36, etc. are covered with resin 37. The wiring layer 35 on the upper surface of the wiring board 32 extends to the peripheral surface of the wiring board 32 to form the electrode terminals 30. The electrode terminal 30 and the wiring layer 2 on the peripheral wall of the through hole 4
Are connected by remelting the solder 39 provided in advance on the electrode terminal 30. An LCC is also suitable as an electronic component to be inserted into the through hole. Further, a surface mount type semiconductor device whose lead shape is a butt lead or a J-type lead is also suitable as an electronic component to be inserted into the through hole. With this structure, it is possible to improve the packaging density of electronic devices.

FIG. 7 is a sectional view showing an essential part of an electronic device according to another embodiment of the present invention. In this embodiment, the package 41 portion of the electronic component 40 made of TSOP is inserted into the through hole 4 provided in the wiring board 1 and the package 4
The leads (electrode terminals) 42 protruding from the peripheral surface of the wiring board 1 are connected to the wiring layer 2 of the wiring board 1 via solder 43. In this example, the packages 41 of the two electronic components 40 are inserted vertically into the through hole 4 of the wiring board 1 and
The lead 42 of the upper electronic component 40 is electrically connected to the wiring layer 2 on the upper surface of the wiring board 1, and the lead 42 of the lower electronic component 40 is electrically connected to the wiring layer 2 on the lower surface of the wiring substrate 1. There is. Further, outside the through hole 4, the other electronic component 2 is arranged so as to straddle the electronic component 40 inserted in the through hole 4.
0 is implemented. The wiring board 1 has a thickness of about 1 mm, the package 41 inserted into the through hole 4 has a thickness of 0.5 mm, and the package of the electronic component 20 straddling the through hole 4 has a thickness of about 1.0 mm. is there. Also in this embodiment, an improvement in packaging density can be achieved.

In the above description, the case where the invention made by the present inventor is mainly applied to the manufacturing technology of the electronic device having the hybrid integrated circuit device structure, which is the field of application in the background, has been described, but the invention is not limited thereto. Not, for example, a memory card made in a limited space,
It can also be applied to small multifunctional products such as pagers, mobile phones, and video cameras. The present invention can be applied to at least an electronic device in which a plurality of electronic components are mounted on a wiring board.

[Brief description of drawings]

FIG. 1 is a sectional view showing a main part of an electronic device according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view showing a wiring board in the manufacture of an electronic device according to an embodiment of the present invention.

FIG. 3 is a cross-sectional view showing a state in which a film substrate is attached to the lower surface of a wiring board in the manufacture of an electronic device according to an embodiment of the present invention.

FIG. 4 is a cross-sectional view showing a state in which a semiconductor chip is incorporated in the film substrate on the lower surface of the wiring substrate, wire-bonded, and sealed in the manufacture of the electronic device according to the embodiment of the present invention.

FIG. 5 is a cross-sectional view showing a state in which a film substrate is attached to the upper surface of a wiring substrate in the manufacture of an electronic device according to an embodiment of the present invention.

FIG. 6 is a sectional view showing an essential part of an electronic device according to another embodiment of the present invention.

FIG. 7 is a sectional view showing an essential part of an electronic device according to another embodiment of the present invention.

[Explanation of symbols]

1, 32 ... Wiring board, 2, 10, 35 ... Wiring layer, 3, 1
1 ... Conductor, 4 ... Through hole, 5, 6 ... Film substrate, 7, 3
4 ... Semiconductor chip, 9 ... Film, 12, 25, 39,
43 ... Solder, 14, 20, 31, 40 ... Electronic component, 1
5, 33 ... Chip mounting pad, 16 ... Silver paste, 1
7, 36 ... Wire, 19, 37 ... Resin, 21, 41 ... Package, 22, 42 ... Lead, 30 ... Electrode terminal.

Claims (4)

[Claims] 1. An electronic device in which an electronic component is mounted in a through hole provided in a wiring board, wherein an electronic circuit is formed on at least one surface of the wiring board so as to form an electronic circuit with the wiring board. An electronic device, wherein a film substrate having a wiring substrate structure connected to the substrate is attached, and electronic components are mounted on the film substrate in the through hole so as to form an electronic circuit. 2. An electronic device in which an electronic component is mounted in a through hole provided in a wiring board, wherein an electronic circuit is formed on at least one surface of the wiring board so as to form an electronic circuit with the wiring board. A film substrate having a wiring board structure connected to the electronic component is attached to the peripheral surface of the electronic component, and a plurality of electrode terminals are provided on the peripheral surface of the electronic component. An electronic device, wherein a wiring layer to be connected is provided on a peripheral wall surface of the through hole. 3. An electronic device in which an electronic component is mounted in a through hole provided in a wiring board, wherein a package portion of the electronic component is inserted into the through hole and a lead protruding from a peripheral surface of the package is wired. An electronic device, which is electrically connected to a wiring layer of a substrate through a bonding material. 4. The package of two electronic components is vertically inserted into the through hole, and the leads of the upper electronic component are electrically connected to the wiring layer on the upper surface of the wiring board, and the leads of the lower electronic component are inserted. The electronic device according to claim 3, wherein the lead is electrically connected to a wiring layer on a lower surface of the wiring board.