JPH0249162U - - Google Patents
Info
- Publication number
- JPH0249162U JPH0249162U JP12714088U JP12714088U JPH0249162U JP H0249162 U JPH0249162 U JP H0249162U JP 12714088 U JP12714088 U JP 12714088U JP 12714088 U JP12714088 U JP 12714088U JP H0249162 U JPH0249162 U JP H0249162U
- Authority
- JP
- Japan
- Prior art keywords
- dividing
- printed wiring
- wiring board
- shaped groove
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図は本考案に係る印刷配線板の一実施例を
示す平面図、第２図は第１図のＡ−Ａ線断面図、
第３図は第１図のＢ−Ｂ線断面図、第４図は本考
案に係る他の実施例を示す平面図、第５図は従来
の印刷配線板を示す平面図、第６図は他の従来の
印刷配線板を示す平面図、第７図は第６図のＡ−
Ａ線断面図。
１１……印刷配線板、１２……分割用区域、１
３……部品実装区域、１４……分割線、１６……
貫通穴、１６′……長穴、１７……Ｖ字状溝、１
９……チツプ部品。
FIG. 1 is a plan view showing an embodiment of a printed wiring board according to the present invention, FIG. 2 is a cross-sectional view taken along line A-A in FIG.
3 is a sectional view taken along the line B-B in FIG. 1, FIG. 4 is a plan view showing another embodiment of the present invention, FIG. 5 is a plan view showing a conventional printed wiring board, and FIG. 6 is a plan view showing another embodiment of the present invention. A plan view showing another conventional printed wiring board, FIG. 7 is A- of FIG. 6.
A-line sectional view. 11...Printed wiring board, 12...Dividing area, 1
3... Component mounting area, 14... Parting line, 16...
Through hole, 16'... Long hole, 17... V-shaped groove, 1
9... Chip parts.
Claims (1)
割線上に沿つて設けた分割用Ｖ字状溝と、この分
割用Ｖ字状溝に重ねて設けた分割用貫通穴とから
分割手段を形成したことを特徴とする印刷配線板
。 In a printed wiring board that is used by dividing an original board, the dividing means is formed from a dividing V-shaped groove provided along the dividing line and a dividing through hole provided overlapping the dividing V-shaped groove. A printed wiring board featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12714088U JPH0249162U (en) | 1988-09-30 | 1988-09-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12714088U JPH0249162U (en) | 1988-09-30 | 1988-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0249162U true JPH0249162U (en) | 1990-04-05 |
Family
ID=31379296
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12714088U Pending JPH0249162U (en) | 1988-09-30 | 1988-09-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0249162U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010258251A (en) * | 2009-04-27 | 2010-11-11 | Keihin Corp | Aggregate substrate |
| JP2013157432A (en) * | 2012-01-30 | 2013-08-15 | Seiko Epson Corp | Substrate assembly, electronic device, and manufacturing method of substrate assembly |
-
1988
- 1988-09-30 JP JP12714088U patent/JPH0249162U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010258251A (en) * | 2009-04-27 | 2010-11-11 | Keihin Corp | Aggregate substrate |
| JP2013157432A (en) * | 2012-01-30 | 2013-08-15 | Seiko Epson Corp | Substrate assembly, electronic device, and manufacturing method of substrate assembly |