JPH01153689U - - Google Patents
Info
- Publication number
- JPH01153689U JPH01153689U JP4616988U JP4616988U JPH01153689U JP H01153689 U JPH01153689 U JP H01153689U JP 4616988 U JP4616988 U JP 4616988U JP 4616988 U JP4616988 U JP 4616988U JP H01153689 U JPH01153689 U JP H01153689U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- pattern portion
- metal pattern
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 7
- 238000010586 diagram Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図は本考案の実施に使用することのできる
プリント配線板の縁部の断面図、第２図は周縁部
の平面図、第３図はこのプリント配線板を金属製
ケースに固定した状態を示す斜視図、第４図は第
３図における半田付け部分の断面図、第５図及び
第６図は従来技術及びその問題点を説明するため
の図である。
２……プリント配線板、４……金属パターン部
、６……スルーホール、８……金属層、１０……
金属製ケース、１２……半田。
Figure 1 is a sectional view of the edge of a printed wiring board that can be used to implement the present invention, Figure 2 is a plan view of the periphery, and Figure 3 is a state in which this printed wiring board is fixed to a metal case. FIG. 4 is a sectional view of the soldered portion in FIG. 3, and FIGS. 5 and 6 are diagrams for explaining the prior art and its problems. 2...Printed wiring board, 4...Metal pattern portion, 6...Through hole, 8...Metal layer, 10...
Metal case, 12...solder.
Claims (1)
する金属パターン部４を形成し、 この金属パターン部４を金属製ケース１０に半
田付けしてなることを特徴とするプリント配線板
の固定構造。[Claims for Utility Model Registration] The present invention is characterized in that a metal pattern portion 4 having through holes 6 is formed on the edge of the printed wiring board 2, and this metal pattern portion 4 is soldered to a metal case 10. Fixed structure of printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4616988U JPH01153689U (en) | 1988-04-05 | 1988-04-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4616988U JPH01153689U (en) | 1988-04-05 | 1988-04-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01153689U true JPH01153689U (en) | 1989-10-23 |
Family
ID=31272449
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4616988U Pending JPH01153689U (en) | 1988-04-05 | 1988-04-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01153689U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62204597A (en) * | 1986-03-05 | 1987-09-09 | 松下電器産業株式会社 | High frequency circuit equipment |
| JPS6333699B2 (en) * | 1980-11-06 | 1988-07-06 | Hodogaya Kagaku Kogyo Kk |
-
1988
- 1988-04-05 JP JP4616988U patent/JPH01153689U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6333699B2 (en) * | 1980-11-06 | 1988-07-06 | Hodogaya Kagaku Kogyo Kk | |
| JPS62204597A (en) * | 1986-03-05 | 1987-09-09 | 松下電器産業株式会社 | High frequency circuit equipment |