JPH01129861U - - Google Patents
Info
- Publication number
- JPH01129861U JPH01129861U JP2451388U JP2451388U JPH01129861U JP H01129861 U JPH01129861 U JP H01129861U JP 2451388 U JP2451388 U JP 2451388U JP 2451388 U JP2451388 U JP 2451388U JP H01129861 U JPH01129861 U JP H01129861U
- Authority
- JP
- Japan
- Prior art keywords
- line
- wiring board
- printed wiring
- approximately
- lands
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007689 inspection Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は、本考案の一実施例の印刷配線板の平
面図、第２図は従来の印刷配線板の平面図である
。
１……（集積回路）接続用パツド、２……ライ
ン、３……検査用ランド、４……基準点、５……
絶縁層。
FIG. 1 is a plan view of a printed wiring board according to an embodiment of the present invention, and FIG. 2 is a plan view of a conventional printed wiring board. 1...(integrated circuit) connection pad, 2...line, 3...land for inspection, 4...reference point, 5...
Insulating layer.
Claims (1)
る印刷配線板において、前記集積回路装置の各ピ
ンに沿つて、標準の２．５４ｍ／ｍ格子にのつた
検査用ランドを配列し、前記ランドと集積回路接
続用パツドとを結ぶラインの幅が略０．２５mmで
あり、前記ラインを含む回路の最小間隙が略０．
３３mmであり、前記ランド、前記ライン、前記パ
ツドを含む矩形の回路パターン面積が３４．１３
cm2以下であることを特徴とする印刷配線板。 In a printed wiring board on which a 160-pin surface-mount integrated circuit device is mounted, test lands arranged in a standard 2.54 m/m grid are arranged along each pin of the integrated circuit device, and the lands and integrated The width of the line connecting the circuit connection pad is approximately 0.25 mm, and the minimum gap of the circuit including the line is approximately 0.25 mm.
33 mm, and the rectangular circuit pattern area including the land, line, and pad is 34.13 mm.
A printed wiring board characterized by having a size of cm 2 or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2451388U JPH0625025Y2 (en) | 1988-02-25 | 1988-02-25 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2451388U JPH0625025Y2 (en) | 1988-02-25 | 1988-02-25 | Printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01129861U true JPH01129861U (en) | 1989-09-04 |
| JPH0625025Y2 JPH0625025Y2 (en) | 1994-06-29 |
Family
ID=31244422
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2451388U Expired - Lifetime JPH0625025Y2 (en) | 1988-02-25 | 1988-02-25 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0625025Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02214187A (en) * | 1989-02-15 | 1990-08-27 | Matsushita Electric Works Ltd | Printed-wiring board |
-
1988
- 1988-02-25 JP JP2451388U patent/JPH0625025Y2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02214187A (en) * | 1989-02-15 | 1990-08-27 | Matsushita Electric Works Ltd | Printed-wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0625025Y2 (en) | 1994-06-29 |