JPH02108364U - - Google Patents
Info
- Publication number
- JPH02108364U JPH02108364U JP1723689U JP1723689U JPH02108364U JP H02108364 U JPH02108364 U JP H02108364U JP 1723689 U JP1723689 U JP 1723689U JP 1723689 U JP1723689 U JP 1723689U JP H02108364 U JPH02108364 U JP H02108364U
- Authority
- JP
- Japan
- Prior art keywords
- pad
- hole
- wiring board
- printed wiring
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Description
第１図ａ，ｂは本考案の第１実施例によるプリ
ント配線基板を示す平面図および断面図、第２図
は第１実施例の半田フイレツトを示す拡大斜視図
、第３図は第２実施例を示す平面図、第４図ａ，
ｂは従来のプリント配線基板を示す平面図および
断面図である。
図において、１―１はリード、２は絶縁板、３
はスルーホール、４はパツド、５は導体パターン
、１６，１７，２６はレジスト膜、１６ａ，２６
ａは露出部、１６ｂ，２６ｂは突出部、を示す。
1A and 1B are a plan view and a sectional view showing a printed wiring board according to a first embodiment of the present invention, FIG. 2 is an enlarged perspective view showing a solder fillet of the first embodiment, and FIG. 3 is a second embodiment. Plan view showing an example, Figure 4a,
b is a plan view and a sectional view showing a conventional printed wiring board. In the figure, 1-1 is a lead, 2 is an insulating plate, and 3
1 is a through hole, 4 is a pad, 5 is a conductor pattern, 16, 17, 26 is a resist film, 16a, 26
a indicates an exposed portion, and 16b and 26b indicate protruding portions.
Claims (1)
つて、上記集積回路素子のリード１―１が挿入さ
れるスルーホール３に形成されたパツド４および
、導体パターン５を形成した絶縁板２の全面に、
各該パツド４表面に該スルーホール３から放射状
に一定幅の露出部１６ａと、該パツド４表面より
該スルーホール３の内側へ一定寸法突出する突出
部１６ｂを設けたレジスト膜１６を形成してなる
ことを特徴とするプリント配線基板。 A printed wiring board on which an integrated circuit element is mounted, a pad 4 formed in a through hole 3 into which a lead 1-1 of the integrated circuit element is inserted, and a conductor pattern 5 formed on the entire surface of an insulating plate 2.
A resist film 16 is formed on the surface of each pad 4, having an exposed portion 16a having a constant width radially extending from the through hole 3, and a protruding portion 16b projecting from the surface of the pad 4 to the inside of the through hole 3 by a constant distance. A printed wiring board characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1723689U JPH02108364U (en) | 1989-02-15 | 1989-02-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1723689U JPH02108364U (en) | 1989-02-15 | 1989-02-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02108364U true JPH02108364U (en) | 1990-08-29 |
Family
ID=31230839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1723689U Pending JPH02108364U (en) | 1989-02-15 | 1989-02-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02108364U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007180078A (en) * | 2005-12-27 | 2007-07-12 | Hitachi Ltd | Printed circuit board |
-
1989
- 1989-02-15 JP JP1723689U patent/JPH02108364U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007180078A (en) * | 2005-12-27 | 2007-07-12 | Hitachi Ltd | Printed circuit board |