JPS625672U - - Google Patents
Info
- Publication number
- JPS625672U JPS625672U JP9710285U JP9710285U JPS625672U JP S625672 U JPS625672 U JP S625672U JP 9710285 U JP9710285 U JP 9710285U JP 9710285 U JP9710285 U JP 9710285U JP S625672 U JPS625672 U JP S625672U
- Authority
- JP
- Japan
- Prior art keywords
- intersection
- circuit pattern
- pad portion
- hole
- rating elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007689 inspection Methods 0.000 description 4
- 239000000523 sample Substances 0.000 description 2
Landscapes
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図Ａは本考案一実施例の印刷配線板の斜視
図、第１図Ｂは第１図Ａの下図の透視図、第２図
は従来例の検査用スルホールランドを設けた印刷
配線板の斜視図である。
１，２……スルホールランド、３……中継用の
回路パターン、４，５……回路パターン、６……
パツド部、８……検査プローブと接触する面の交
点と反対面側の交点、９……検査プローブ、１０
……印刷配線板、１１……汎用の検査治具。
FIG. 1A is a perspective view of a printed wiring board according to an embodiment of the present invention, FIG. 1B is a perspective view of the lower part of FIG. 1A, and FIG. 2 is a conventional printed wiring board provided with through-hole lands for inspection. FIG. 1, 2... Through hole land, 3... Circuit pattern for relay, 4, 5... Circuit pattern, 6...
Pad part, 8... Intersection of the surface in contact with the inspection probe and the intersection on the opposite side, 9... Inspection probe, 10
...Printed wiring board, 11...General-purpose inspection jig.
Claims (1)
ホールランドのうち、定格子の交点上から外れた
位置に設けられた第１のスルホールランドの近傍
の定格子の交点上の空所にパツド部を設け、かつ
前記パツド部と第１のスルホールランドとを中継
用の回路パターンにより接続することを特徴とす
る印刷配線板。 Among the through-hole lands connected to the circuit pattern formed on the insulating plate, a pad portion is provided in a space above the intersection of the rating elements near the first through-hole land provided at a position away from the intersection of the rating elements, and A printed wiring board characterized in that a pad portion and a first through-hole land are connected by a relay circuit pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9710285U JPS625672U (en) | 1985-06-26 | 1985-06-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9710285U JPS625672U (en) | 1985-06-26 | 1985-06-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS625672U true JPS625672U (en) | 1987-01-14 |
Family
ID=30963691
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9710285U Pending JPS625672U (en) | 1985-06-26 | 1985-06-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS625672U (en) |
-
1985
- 1985-06-26 JP JP9710285U patent/JPS625672U/ja active Pending