JPS62197077U - - Google Patents
Info
- Publication number
- JPS62197077U JPS62197077U JP8565686U JP8565686U JPS62197077U JP S62197077 U JPS62197077 U JP S62197077U JP 8565686 U JP8565686 U JP 8565686U JP 8565686 U JP8565686 U JP 8565686U JP S62197077 U JPS62197077 U JP S62197077U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- intersection
- circuit pattern
- rating elements
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000011800 void material Substances 0.000 claims 1
- 238000007689 inspection Methods 0.000 description 3
- 239000000523 sample Substances 0.000 description 2
Landscapes
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図Ａは本考案実施例の印刷配線板の斜視図
、第１図Ｂは第１図Ａの裏面状態を示す透視図、
第１図Ｃは第１図Ａの主要部の断面図である。第
２図Ａ，Ｂは従来例の検査用スルホールランドを
設けた印刷配線板の斜視図である。
１，２，７……スルホールランド、３……中継
用の回路パターン、４，５……回路パターン、６
……非貫通の導通穴、８……検査プローブと接触
する面の交点と反対側の交点、９……検査プロー
ブ、１０……印刷配線板、１１……汎用の検査治
具。
FIG. 1A is a perspective view of a printed wiring board according to an embodiment of the present invention, FIG. 1B is a perspective view showing the back side of FIG. 1A,
FIG. 1C is a sectional view of the main part of FIG. 1A. 2A and 2B are perspective views of a printed wiring board provided with a conventional through-hole land for inspection. 1, 2, 7... Through hole land, 3... Circuit pattern for relay, 4, 5... Circuit pattern, 6
. . . Non-penetrating conductive hole, 8 . . . Intersection on the opposite side to the intersection of the surface that contacts the inspection probe, 9 . . . Inspection probe, 10 . . . Printed wiring board, 11 .
Claims (1)
つ定格子の交点上から外れた位置に設けられたス
ルホールランドの近傍の定格子の交点上の空所に
、非貫通の導通穴を設け、前記非貫通の導通穴と
前記スルホールランドとを中継用の回路パターン
により接続することを特徴とする印刷配線板。 A non-penetrating conductive hole is provided in a void above the intersection of the rating elements near the through-hole land that is connected to the circuit pattern provided on the insulating board and is provided at a position away from the intersection of the rating elements. A printed wiring board characterized in that the conductive hole and the through hole land are connected by a relay circuit pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8565686U JPS62197077U (en) | 1986-06-04 | 1986-06-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8565686U JPS62197077U (en) | 1986-06-04 | 1986-06-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62197077U true JPS62197077U (en) | 1987-12-15 |
Family
ID=30941260
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8565686U Pending JPS62197077U (en) | 1986-06-04 | 1986-06-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62197077U (en) |
-
1986
- 1986-06-04 JP JP8565686U patent/JPS62197077U/ja active Pending