JPH0379476U - - Google Patents
Info
- Publication number
- JPH0379476U JPH0379476U JP14085089U JP14085089U JPH0379476U JP H0379476 U JPH0379476 U JP H0379476U JP 14085089 U JP14085089 U JP 14085089U JP 14085089 U JP14085089 U JP 14085089U JP H0379476 U JPH0379476 U JP H0379476U
- Authority
- JP
- Japan
- Prior art keywords
- electrical elements
- circuit board
- printed circuit
- wiring pattern
- solder layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Description
図面は本考案の実施例を示すもので、第１図は
回路全体を示す平面図、第２図は本考案の要部断
面図である。
１０……プリント基板、１１……プリント配線
、１３……パワートラジスタ、１５……バスバー
、１６……電力供給ライン、１７……半田、１７
ａ……半田層。
The drawings show an embodiment of the present invention, and FIG. 1 is a plan view showing the entire circuit, and FIG. 2 is a sectional view of the main part of the present invention. 10... Printed circuit board, 11... Printed wiring, 13... Power transistor, 15... Bus bar, 16... Power supply line, 17... Solder, 17
a...Solder layer.
Claims (1)
素子同士をエツチング等によつて形成した配線パ
ターンで接続したプリント基板において、前記配
線パターン上に電気素子同士を接続する半田層を
形成したことを特徴とするプリント基板の配線構
造。 In a printed circuit board in which electrical elements such as resistors are arranged on a substrate and these electrical elements are connected to each other by a wiring pattern formed by etching etc., a solder layer is formed on the wiring pattern to connect the electrical elements to each other. A printed circuit board wiring structure characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14085089U JPH0379476U (en) | 1989-12-05 | 1989-12-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14085089U JPH0379476U (en) | 1989-12-05 | 1989-12-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0379476U true JPH0379476U (en) | 1991-08-13 |
Family
ID=31687792
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14085089U Pending JPH0379476U (en) | 1989-12-05 | 1989-12-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0379476U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6245859B2 (en) * | 1978-02-16 | 1987-09-29 | Nippon Kayaku Kk |
-
1989
- 1989-12-05 JP JP14085089U patent/JPH0379476U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6245859B2 (en) * | 1978-02-16 | 1987-09-29 | Nippon Kayaku Kk |