JPH0160578U - - Google Patents
Info
- Publication number
- JPH0160578U JPH0160578U JP1987156319U JP15631987U JPH0160578U JP H0160578 U JPH0160578 U JP H0160578U JP 1987156319 U JP1987156319 U JP 1987156319U JP 15631987 U JP15631987 U JP 15631987U JP H0160578 U JPH0160578 U JP H0160578U
- Authority
- JP
- Japan
- Prior art keywords
- power supply
- electronic component
- superconductor
- power
- ground layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002887 superconductor Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Superconductor Devices And Manufacturing Methods Thereof (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
Description
第１図はこの考案による多層印刷配線板の外観
構成を示す斜視図、第２図は第１図に示す多層印
刷配線板の抵抗成分を示す電気的等価回路図、第
３図は従来の多層印刷配線板の外観構成を示す斜
視図、第４図は第３図に示す多層印刷配線板の抵
抗成分を示す電気的等価回路図。
１ａ，１ｂ，５はそれぞれ絶縁層、７ａ，７ｂ
，７ｃ及び８ａ，８ｂ，８ｃはそれぞれＩＣ、９
ａ，９ｂはそれぞれコネクタ、１８は超電導体を
用いた電源供給層、１９は超電導体を用いた接地
層。なお、各図中同一符号は同一又は相当部分を
示すものとする。
Fig. 1 is a perspective view showing the external structure of the multilayer printed wiring board according to this invention, Fig. 2 is an electrical equivalent circuit diagram showing the resistance component of the multilayer printed wiring board shown in Fig. 1, and Fig. 3 is a conventional multilayer printed wiring board. FIG. 4 is a perspective view showing the external structure of the printed wiring board, and FIG. 4 is an electrical equivalent circuit diagram showing the resistance component of the multilayer printed wiring board shown in FIG. 3. 1a, 1b, 5 are insulating layers, 7a, 7b, respectively.
, 7c and 8a, 8b, 8c are IC, 9, respectively.
18 is a power supply layer using a superconductor, and 19 is a ground layer using a superconductor. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
と、素材に超電導体を用いて形成された接地層と
、この接地層と上記電源供給層とを互いに絶縁す
る絶縁層とを有し、 表面にコネクタ及び電子部品を実装して上記コ
ネクタを通じて外部から電源の供給をうけ上記電
源供給層を通じて上記電子部品に電源を供給し、 電子部品の接地は上記接地層を通じて行うこと
を特徴とする多層印刷配線板。[Claims for Utility Model Registration] A power supply layer formed using a superconductor as a material, a ground layer formed using a superconductor as a material, and insulating the ground layer and the power supply layer from each other. A connector and an electronic component are mounted on the surface, and power is supplied from the outside through the connector, and power is supplied to the electronic component through the power supply layer, and the electronic component is grounded through the ground layer. A multilayer printed wiring board characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987156319U JPH0160578U (en) | 1987-10-13 | 1987-10-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987156319U JPH0160578U (en) | 1987-10-13 | 1987-10-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0160578U true JPH0160578U (en) | 1989-04-17 |
Family
ID=31434755
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987156319U Pending JPH0160578U (en) | 1987-10-13 | 1987-10-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0160578U (en) |
-
1987
- 1987-10-13 JP JP1987156319U patent/JPH0160578U/ja active Pending