JPH0262776U - - Google Patents
Info
- Publication number
- JPH0262776U JPH0262776U JP14211788U JP14211788U JPH0262776U JP H0262776 U JPH0262776 U JP H0262776U JP 14211788 U JP14211788 U JP 14211788U JP 14211788 U JP14211788 U JP 14211788U JP H0262776 U JPH0262776 U JP H0262776U
- Authority
- JP
- Japan
- Prior art keywords
- copper layer
- power supply
- wiring board
- printed wiring
- supply wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229920003217 poly(methylsilsesquioxane) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Description
第１図は本考案に係るプリント配線板の一実施
例を示す要部構成図、第２図は本考案の他の実施
例構成図、第３図は従来の多層プリント配線板の
一例を示す構成図である。
１……部品面配線用銅層、２，６……絶縁用ガ
ラス・エポキシ樹脂層、３，３ａ，３ｂ……電源
配線用銅層、５……アース回路用銅層、４ａ，４
ｂ……高誘電率材料層、７……半田面配線用銅層
。
Fig. 1 is a block diagram of the main parts of an embodiment of a printed wiring board according to the present invention, Fig. 2 is a block diagram of another embodiment of the present invention, and Fig. 3 is an example of a conventional multilayer printed wiring board. FIG. 1... Copper layer for component surface wiring, 2, 6... Insulating glass/epoxy resin layer, 3, 3a, 3b... Copper layer for power supply wiring, 5... Copper layer for earth circuit, 4a, 4
b... High dielectric constant material layer, 7... Copper layer for solder surface wiring.
Claims (1)
の電気回路用プリント配線板において、 前記電源用配線銅層とアース回路用銅層との間
に高誘電率材料を用いた絶縁層を介在させるよう
に構成したことを特徴とするプリント配線板。[Scope of Claim for Utility Model Registration] A multilayer printed wiring board for electric circuits having a power supply wiring copper layer and a grounding circuit copper layer, wherein a high dielectric constant is provided between the power supply wiring copper layer and the earthing circuit copper layer. 1. A printed wiring board characterized in that it is configured to include an insulating layer made of a material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14211788U JPH0262776U (en) | 1988-10-31 | 1988-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14211788U JPH0262776U (en) | 1988-10-31 | 1988-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0262776U true JPH0262776U (en) | 1990-05-10 |
Family
ID=31407790
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14211788U Pending JPH0262776U (en) | 1988-10-31 | 1988-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0262776U (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5368870A (en) * | 1976-12-01 | 1978-06-19 | Oki Electric Ind Co Ltd | Multilayer board |
| JPS57133698A (en) * | 1981-02-12 | 1982-08-18 | Nippon Electric Co | Ceramic multilayer circuit |
| JPS60177696A (en) * | 1984-02-23 | 1985-09-11 | 日本電気株式会社 | Composite ceramic board |
-
1988
- 1988-10-31 JP JP14211788U patent/JPH0262776U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5368870A (en) * | 1976-12-01 | 1978-06-19 | Oki Electric Ind Co Ltd | Multilayer board |
| JPS57133698A (en) * | 1981-02-12 | 1982-08-18 | Nippon Electric Co | Ceramic multilayer circuit |
| JPS60177696A (en) * | 1984-02-23 | 1985-09-11 | 日本電気株式会社 | Composite ceramic board |
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