JPH0434760U - - Google Patents
Info
- Publication number
- JPH0434760U JPH0434760U JP7638690U JP7638690U JPH0434760U JP H0434760 U JPH0434760 U JP H0434760U JP 7638690 U JP7638690 U JP 7638690U JP 7638690 U JP7638690 U JP 7638690U JP H0434760 U JPH0434760 U JP H0434760U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- copper foil
- foil pattern
- conductor
- board structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図ａは、本考案の回路基板構造の実施例を
示す要部の断面図。第１図ｂは、本考案の回路基
板構造の実施例を示す要部の銅箔パターン図。第
２図は、従来の回路基板構造を示す要部断面図。
１１……回路基板、１２……導体、１３……電
子部品、１４……その他の電子部品、Ａ……孤立
した銅箔パターン。
FIG. 1a is a sectional view of essential parts showing an embodiment of the circuit board structure of the present invention. FIG. 1b is a copper foil pattern diagram of the main part showing an embodiment of the circuit board structure of the present invention. FIG. 2 is a sectional view of main parts showing a conventional circuit board structure. 11... Circuit board, 12... Conductor, 13... Electronic component, 14... Other electronic component, A... Isolated copper foil pattern.
Claims (1)
路基板構造において、前記回路基板の前記導体と
対向する面１１−ａに他の回路より孤立した銅箔
パターンを有し、前記銅箔パターンと同一面に配
置された他の電子部品より背の高い電子部品１３
を前記銅箔パターン上に実装したことを特徴とす
る回路基板構造。 In a circuit board structure in which a circuit board 11 and a conductor 12 are insulated and fixed, a surface 11-a of the circuit board facing the conductor has a copper foil pattern isolated from other circuits, and is the same as the copper foil pattern. Electronic component 13 that is taller than other electronic components arranged on the surface
A circuit board structure characterized in that: is mounted on the copper foil pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7638690U JPH0434760U (en) | 1990-07-18 | 1990-07-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7638690U JPH0434760U (en) | 1990-07-18 | 1990-07-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0434760U true JPH0434760U (en) | 1992-03-23 |
Family
ID=31617810
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7638690U Pending JPH0434760U (en) | 1990-07-18 | 1990-07-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0434760U (en) |
-
1990
- 1990-07-18 JP JP7638690U patent/JPH0434760U/ja active Pending