JPH0415257U - - Google Patents
Info
- Publication number
- JPH0415257U JPH0415257U JP5580290U JP5580290U JPH0415257U JP H0415257 U JPH0415257 U JP H0415257U JP 5580290 U JP5580290 U JP 5580290U JP 5580290 U JP5580290 U JP 5580290U JP H0415257 U JPH0415257 U JP H0415257U
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- ground circuit
- hole
- shield layer
- base insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 2
- 239000010408 film Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000012787 coverlay film Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案のシールド付フレキシブル配線
板の具体例の要部の断面図である。第２図は従来
のシールド付フレキシブル配線板の上面図、第３
図はその要部の断面図である。
１……ベース絶縁フイルム、２……接着剤層、
３……信号回路、４……アース回路、５……絶縁
フイルム、６……貫通孔、７……シールド層、８
……カバーレイフイルム、９……カバーレイ接着
剤。
FIG. 1 is a sectional view of a main part of a specific example of the shielded flexible wiring board of the present invention. Figure 2 is a top view of a conventional shielded flexible wiring board;
The figure is a sectional view of the main part. 1...Base insulating film, 2...Adhesive layer,
3... Signal circuit, 4... Earth circuit, 5... Insulating film, 6... Through hole, 7... Shield layer, 8
...Coverlay film, 9...Coverlay adhesive.
Claims (1)
した信号回路及びアース回路を間にして前記ベー
ス絶縁フイルムと絶縁フイルムとを接着した基板
の前記アース回路上に貫通孔を設け、上記貫通孔
及び基板の外側面を含み、絶縁フイルムの上面及
びベース絶縁フイルムの裏面に導電性ペーストに
よるシールド層を形成すると同時にシールド層と
アース回路を接続し、さらに基板の外側面を含み
シールド層の上下に絶縁カバーレイ層を形成した
ことを特徴とするシールド付フレキシブル配線板
。 A through hole is provided on the ground circuit of the substrate on which the base insulating film and the insulating film are bonded, with a signal circuit and a ground circuit fixed in a predetermined arbitrary shape on the base insulating film interposed therebetween, and a through hole is provided between the through hole and the ground circuit of the substrate. A shield layer made of conductive paste is formed on the top surface of the insulating film, including the outer surface, and the back surface of the base insulating film, and at the same time, the shield layer and the ground circuit are connected, and an insulating cover layer is formed above and below the shield layer, including the outer surface of the board. A flexible wiring board with a shield characterized by forming a layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5580290U JPH0521901Y2 (en) | 1990-05-28 | 1990-05-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5580290U JPH0521901Y2 (en) | 1990-05-28 | 1990-05-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0415257U true JPH0415257U (en) | 1992-02-06 |
| JPH0521901Y2 JPH0521901Y2 (en) | 1993-06-04 |
Family
ID=31579078
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5580290U Expired - Lifetime JPH0521901Y2 (en) | 1990-05-28 | 1990-05-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0521901Y2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003110207A (en) * | 2001-09-28 | 2003-04-11 | Alps Electric Co Ltd | Flexible substrate |
| US8456851B2 (en) | 2008-05-16 | 2013-06-04 | Apple Inc. | Flex circuit with single sided routing and double sided attach |
| JP2018061011A (en) * | 2016-01-21 | 2018-04-12 | 東洋インキＳｃホールディングス株式会社 | Electromagnetic wave shielding sheet and printed wiring board |
-
1990
- 1990-05-28 JP JP5580290U patent/JPH0521901Y2/ja not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003110207A (en) * | 2001-09-28 | 2003-04-11 | Alps Electric Co Ltd | Flexible substrate |
| US8456851B2 (en) | 2008-05-16 | 2013-06-04 | Apple Inc. | Flex circuit with single sided routing and double sided attach |
| JP2018061011A (en) * | 2016-01-21 | 2018-04-12 | 東洋インキＳｃホールディングス株式会社 | Electromagnetic wave shielding sheet and printed wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0521901Y2 (en) | 1993-06-04 |