JPS61201363U - - Google Patents
Info
- Publication number
- JPS61201363U JPS61201363U JP8481385U JP8481385U JPS61201363U JP S61201363 U JPS61201363 U JP S61201363U JP 8481385 U JP8481385 U JP 8481385U JP 8481385 U JP8481385 U JP 8481385U JP S61201363 U JPS61201363 U JP S61201363U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- layer
- fpc
- foil layer
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図ａは本考案の二層ＦＰＣにおける接地構
造の一実施例を示す断面図、第１図ｂは第１図ａ
におけるＡ部拡大図、第２図は従来の二層ＦＰＣ
における接地構造の一例を示す断面図である。
１……プリント基板、２，３，４……ＦＰＣ、
２′……絶縁フイルム面、５……アース、６……
銅箔層、７……絶縁層、８……接着剤、９……絶
縁テープ。
Figure 1a is a sectional view showing an embodiment of the grounding structure in the two-layer FPC of the present invention, and Figure 1b is
An enlarged view of part A in Figure 2 is a conventional two-layer FPC.
It is a sectional view showing an example of the grounding structure in . 1...Printed circuit board, 2, 3, 4...FPC,
2'...Insulating film surface, 5...Earth, 6...
Copper foil layer, 7... Insulating layer, 8... Adhesive, 9... Insulating tape.
Claims (1)
層化されたフレキシブルプリント基板（以下ＦＰ
Ｃと記す）において、下層ＦＰＣと接着された上
層ＦＰＣは銅箔層とそれを覆う絶縁層とから成り
、前記銅箔層の一端部を通信用アースと接続する
ことを特徴とする二層ＦＰＣにおける接地構造。 A double-layered flexible printed circuit board (hereinafter referred to as FP) used in equipment equipped with a plastic cover.
C), the upper layer FPC bonded to the lower layer FPC consists of a copper foil layer and an insulating layer covering it, and one end of the copper foil layer is connected to a communication ground. Grounding structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8481385U JPS61201363U (en) | 1985-06-05 | 1985-06-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8481385U JPS61201363U (en) | 1985-06-05 | 1985-06-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61201363U true JPS61201363U (en) | 1986-12-17 |
Family
ID=30634638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8481385U Pending JPS61201363U (en) | 1985-06-05 | 1985-06-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61201363U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63100007U (en) * | 1986-12-19 | 1988-06-29 |
-
1985
- 1985-06-05 JP JP8481385U patent/JPS61201363U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63100007U (en) * | 1986-12-19 | 1988-06-29 |