JPS61138269U - - Google Patents
Info
- Publication number
- JPS61138269U JPS61138269U JP2097885U JP2097885U JPS61138269U JP S61138269 U JPS61138269 U JP S61138269U JP 2097885 U JP2097885 U JP 2097885U JP 2097885 U JP2097885 U JP 2097885U JP S61138269 U JPS61138269 U JP S61138269U
- Authority
- JP
- Japan
- Prior art keywords
- wiring layer
- board
- folded
- rigid
- back side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 239000002390 adhesive tape Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図及び第２図は本考案の一実施例の接続構
造を示す斜視図及び断面図、第３図及び第４図は
従来の各接続構造を示す斜視図及び断面図である
。
１０…フレキシブル基板、１１…表面側端部、
１２ａ〜１２ｈ…フレキシブル基板の配線層、１
３…裏面、２０…リジツト基板、２１ａ〜２１ｈ
…リジツト基板の配線層、３０…両面接着テープ
、４０…はんだ。
1 and 2 are a perspective view and a sectional view showing a connection structure according to an embodiment of the present invention, and FIGS. 3 and 4 are a perspective view and a sectional view showing each conventional connection structure. 10...Flexible substrate, 11...Front side end,
12a to 12h...wiring layer of flexible board, 1
3...Back surface, 20...Rigid substrate, 21a to 21h
...Wiring layer of rigid board, 30...Double-sided adhesive tape, 40...Solder.
Claims (1)
面側に折返されたフレキシブル基板と、 配線層が形成されたリジツト基板と、 前記フレキシブル基板の折返された表面側端部
を裏面側に固定すると共に、この折返された表面
側端部の配線層をリジツト基板の対応の配線層上
に位置決めする両面接着テープとを備えたことを
特徴とするフレキシブル基板とリジツト基板の接
続構造。[Claims for Utility Model Registration] A flexible substrate on which a wiring layer is formed and whose front end is folded back to the back side, a rigid substrate on which a wiring layer is formed, and the folded surface of the flexible substrate. A flexible board and a rigid board characterized by comprising a double-sided adhesive tape that fixes the side end to the back side and positions the wiring layer of the folded front end on the corresponding wiring layer of the rigid board. Board connection structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2097885U JPS61138269U (en) | 1985-02-16 | 1985-02-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2097885U JPS61138269U (en) | 1985-02-16 | 1985-02-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61138269U true JPS61138269U (en) | 1986-08-27 |
Family
ID=30511963
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2097885U Pending JPS61138269U (en) | 1985-02-16 | 1985-02-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61138269U (en) |
-
1985
- 1985-02-16 JP JP2097885U patent/JPS61138269U/ja active Pending