JPH01171061U - - Google Patents
Info
- Publication number
- JPH01171061U JPH01171061U JP6683888U JP6683888U JPH01171061U JP H01171061 U JPH01171061 U JP H01171061U JP 6683888 U JP6683888 U JP 6683888U JP 6683888 U JP6683888 U JP 6683888U JP H01171061 U JPH01171061 U JP H01171061U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- flexible printed
- electrode
- shape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000006071 cream Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案を実施したフレキシブルプリン
ト基板の断面ＡＡ図、第２図は本考案を実施した
フレキシブルプリント基板の上面図、第３図はフ
レキシブルプリント基板の接合される基板の側面
図、第４図は接合されたときの断面図、第５図は
従来のフレキシブルプリント基板の断面ＢＢ図、
第６図は従来のフレキシブルプリント基板の断面
ＣＣ図、第７図は従来のフレキシブルプリント基
板の上面図である。
１……両面テープ、２……フレキシブルベース
材、３……接着剤、４……銅箔、５……カバーレ
イ、６……半田、７……ベース材、８……銅箔、
９……接着剤、１０……レジスト、１１……クリ
ーム半田、１２……半田。
Fig. 1 is a cross-sectional AA view of a flexible printed circuit board embodying the present invention, Fig. 2 is a top view of a flexible printed circuit board embodying the present invention, and Fig. 3 is a side view of the board to which the flexible printed circuit board is bonded. Figure 4 is a cross-sectional view of the bonded board, Figure 5 is a cross-sectional BB diagram of a conventional flexible printed circuit board,
FIG. 6 is a cross-sectional CC view of a conventional flexible printed circuit board, and FIG. 7 is a top view of the conventional flexible printed circuit board. 1... Double-sided tape, 2... Flexible base material, 3... Adhesive, 4... Copper foil, 5... Coverlay, 6... Solder, 7... Base material, 8... Copper foil,
9...adhesive, 10...resist, 11...cream solder, 12...solder.
Claims (1)
するフレキシブルプリント基板であつて、該両面
電極露出部の形状が、谷折れ形であることを特徴
とするフレキシブルプリント基板。 1. A flexible printed circuit board having at least one electrode exposed on both the front and back surfaces, wherein the shape of the exposed portion of the electrode on both surfaces is a valley-fold shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6683888U JPH01171061U (en) | 1988-05-23 | 1988-05-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6683888U JPH01171061U (en) | 1988-05-23 | 1988-05-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01171061U true JPH01171061U (en) | 1989-12-04 |
Family
ID=31292225
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6683888U Pending JPH01171061U (en) | 1988-05-23 | 1988-05-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01171061U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012146353A (en) * | 2011-01-07 | 2012-08-02 | Sumitomo Electric Printed Circuit Inc | Flexible wiring board, connection structure of wiring board and method of manufacturing thereof |
-
1988
- 1988-05-23 JP JP6683888U patent/JPH01171061U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012146353A (en) * | 2011-01-07 | 2012-08-02 | Sumitomo Electric Printed Circuit Inc | Flexible wiring board, connection structure of wiring board and method of manufacturing thereof |
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