JPS6364071U - - Google Patents
Info
- Publication number
- JPS6364071U JPS6364071U JP15893486U JP15893486U JPS6364071U JP S6364071 U JPS6364071 U JP S6364071U JP 15893486 U JP15893486 U JP 15893486U JP 15893486 U JP15893486 U JP 15893486U JP S6364071 U JPS6364071 U JP S6364071U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- sided board
- double
- side wall
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例を示す断面を示す図
、第２図は本考案の一実施例の変形例を示す断面
図、第３図は従来の両面基板を示す断面図、第４
図は第３図のスルーフオール部分を拡大した断面
図である。
１……基板基材、２……レジスト膜、３……ス
ルーフオール、４……銅箔、４ａ……微細孔、５
……半田、６……半田粒、Ａ……銅箔除去部。
FIG. 1 is a cross-sectional view showing an embodiment of the present invention, FIG. 2 is a cross-sectional view showing a modification of the embodiment of the present invention, FIG. 3 is a cross-sectional view showing a conventional double-sided board, and FIG.
The figure is an enlarged sectional view of the through-all portion of FIG. 3. 1... Substrate base material, 2... Resist film, 3... Through all, 4... Copper foil, 4a... Fine hole, 5
...Solder, 6...Solder grain, A...Copper foil removed part.
Claims (1)
ンが形成される両面基板において、前記スルーフ
オールの側壁の一部の銅箔を除去したことを特徴
とする両面基板。 1. A double-sided board on which a circuit pattern is formed on both the front and back sides by a through-all, characterized in that a part of the copper foil on the side wall of the through-all is removed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15893486U JPS6364071U (en) | 1986-10-17 | 1986-10-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15893486U JPS6364071U (en) | 1986-10-17 | 1986-10-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6364071U true JPS6364071U (en) | 1988-04-27 |
Family
ID=31082893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15893486U Pending JPS6364071U (en) | 1986-10-17 | 1986-10-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6364071U (en) |
-
1986
- 1986-10-17 JP JP15893486U patent/JPS6364071U/ja active Pending