JPS63193875U - - Google Patents

Info

Publication number
JPS63193875U
JPS63193875U JP8516787U JP8516787U JPS63193875U JP S63193875 U JPS63193875 U JP S63193875U JP 8516787 U JP8516787 U JP 8516787U JP 8516787 U JP8516787 U JP 8516787U JP S63193875 U JPS63193875 U JP S63193875U
Authority
JP
Japan
Prior art keywords
board
cutting
groove
hard
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8516787U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8516787U priority Critical patent/JPS63193875U/ja
Publication of JPS63193875U publication Critical patent/JPS63193875U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

図面は本考案の実施例を示すもので、第１図は
本案品の拡大側面図、第２図は第１図の底面図、
第３図は表裏面にプリント回路を設けた場合の拡
大一部側面図、第４図は要部の拡大断面図、第５
図は従来品の拡大側面図、第６図は従来品の分解
図である。 １……肉厚１枚の樹脂硬質板、２……銅箔回路
、３……肉薄部、４……切削溝。 The drawings show an embodiment of the present invention; Fig. 1 is an enlarged side view of the proposed product, Fig. 2 is a bottom view of Fig. 1,
Figure 3 is an enlarged partial side view of the case where printed circuits are provided on the front and back sides, Figure 4 is an enlarged sectional view of the main part, and Figure 5 is an enlarged sectional view of the main part.
The figure is an enlarged side view of the conventional product, and FIG. 6 is an exploded view of the conventional product. 1... One thick resin hard plate, 2... Copper foil circuit, 3... Thin wall portion, 4... Cutting groove.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 肉厚１枚の樹脂硬質板１の表面又は表裏両面に
銅箔回路２をプリントし、該硬質板１の裏面の所
定一部に対し、板面を横切り表面を肉薄部３に残
して所要溝巾の切削溝４を切削形成し、該肉薄部
３にフレキ性を持たせてなることを特徴とする一
部可撓性を持つ回路基板。 A copper foil circuit 2 is printed on the front surface or both the front and back surfaces of a hard resin board 1 with one wall thickness, and a required groove is formed on a predetermined part of the back surface of the hard board 1 by cutting across the board surface and leaving the surface in the thin part 3. A partially flexible circuit board characterized in that a wide cutting groove 4 is formed by cutting, and the thin wall portion 3 is made flexible.
JP8516787U 1987-05-29 1987-05-29 Pending JPS63193875U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8516787U JPS63193875U (en) 1987-05-29 1987-05-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8516787U JPS63193875U (en) 1987-05-29 1987-05-29

Publications (1)

Publication Number Publication Date
JPS63193875U true JPS63193875U (en) 1988-12-14

Family

ID=30940326

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8516787U Pending JPS63193875U (en) 1987-05-29 1987-05-29

Country Status (1)

Country Link
JP (1) JPS63193875U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017022183A (en) * 2015-07-07 2017-01-26 矢崎総業株式会社 Electronic component unit substrate, and electronic component unit
JP2018182215A (en) * 2017-04-20 2018-11-15 日本シイエムケイ株式会社 Manufacturing method of rigid/flex multilayer printed wiring board

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5388157A (en) * 1977-01-13 1978-08-03 Matsushita Electric Ind Co Ltd Printed circuit board
JPS6355568B2 (en) * 1982-08-16 1988-11-02 Shimizu Construction Co Ltd

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5388157A (en) * 1977-01-13 1978-08-03 Matsushita Electric Ind Co Ltd Printed circuit board
JPS6355568B2 (en) * 1982-08-16 1988-11-02 Shimizu Construction Co Ltd

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017022183A (en) * 2015-07-07 2017-01-26 矢崎総業株式会社 Electronic component unit substrate, and electronic component unit
JP2018182215A (en) * 2017-04-20 2018-11-15 日本シイエムケイ株式会社 Manufacturing method of rigid/flex multilayer printed wiring board

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