JPS63170996U - - Google Patents
Info
- Publication number
- JPS63170996U JPS63170996U JP6333387U JP6333387U JPS63170996U JP S63170996 U JPS63170996 U JP S63170996U JP 6333387 U JP6333387 U JP 6333387U JP 6333387 U JP6333387 U JP 6333387U JP S63170996 U JPS63170996 U JP S63170996U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- heat sink
- insulating plate
- board assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Description
第1図および第2図はこの考案の実施例を示し
、第1図は電子部品を取り付けた状態におけるプ
リント回路基板アセンブリの斜視図、第2図は第
1図の―線断面図である。第3図および第4
図は従来の例を示し、第3図は電子部品を取り付
けた状態におけるプリント回路基板アセンブリの
斜視図、第4図は第3図の―線断面図である
。
1……プリント回路基板、3……放熱板、5…
…絶縁板。
1 and 2 show an embodiment of this invention; FIG. 1 is a perspective view of a printed circuit board assembly with electronic components attached thereto, and FIG. 2 is a sectional view taken along the line -- in FIG. 1. Figures 3 and 4
The figures show a conventional example; FIG. 3 is a perspective view of a printed circuit board assembly with electronic components attached thereto, and FIG. 4 is a sectional view taken along the line -- in FIG. 1... Printed circuit board, 3... Heat sink, 5...
...Insulating board.
Claims (1)
おいて、プリント回路基板の上面に絶縁板を配し
、この絶縁板の上面に前記の放熱板を接合させた
ことを特徴とするプリント回路基板アセンブリ。 1. A printed circuit board assembly including a heat sink, characterized in that an insulating plate is disposed on the upper surface of the printed circuit board, and the heat sink is bonded to the upper surface of the insulating plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6333387U JPS63170996U (en) | 1987-04-24 | 1987-04-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6333387U JPS63170996U (en) | 1987-04-24 | 1987-04-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63170996U true JPS63170996U (en) | 1988-11-07 |
Family
ID=30898459
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6333387U Pending JPS63170996U (en) | 1987-04-24 | 1987-04-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63170996U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02106857U (en) * | 1989-02-10 | 1990-08-24 |
-
1987
- 1987-04-24 JP JP6333387U patent/JPS63170996U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02106857U (en) * | 1989-02-10 | 1990-08-24 |