JPH0334269U - - Google Patents
Info
- Publication number
- JPH0334269U JPH0334269U JP9549889U JP9549889U JPH0334269U JP H0334269 U JPH0334269 U JP H0334269U JP 9549889 U JP9549889 U JP 9549889U JP 9549889 U JP9549889 U JP 9549889U JP H0334269 U JPH0334269 U JP H0334269U
- Authority
- JP
- Japan
- Prior art keywords
- sides
- circuit pattern
- board
- circuit
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は両面にチツプ部品を実装した状態で示
す本考案実施例の縦断面図、第２図は両面にチツ
プ部品を実装した状態で示す従来の両面回路基板
の縦断面図である。
１……回路基板、２ａ，２ｂ……チツプ部品、
３ｂ，３ｃ……半田、４……接着剤、５ａ……表
面側の回路パターン、５ａ′……裏面に引き出さ
れた回路パターン、５ｂ……裏面側の回路パター
ン、６……スルーホール。
FIG. 1 is a vertical sectional view of an embodiment of the present invention shown with chip components mounted on both sides, and FIG. 2 is a vertical sectional view of a conventional double-sided circuit board with chip components mounted on both sides. 1... Circuit board, 2a, 2b... Chip parts,
3b, 3c...Solder, 4...Adhesive, 5a...Circuit pattern on the front side, 5a'...Circuit pattern pulled out on the back side, 5b...Circuit pattern on the back side, 6...Through hole.
Claims (1)
成され、その両面の回路にそれぞれチツプ部品が
実装されるよう構成された基板において、一方の
面の回路パターン上のチツプ部品搭載位置にスル
ーホールが形成され、かつ、その回路パターンは
このスルーホールの内面を介して他方の面にまで
達していることを特徴とする両面回路基板。 In a board configured such that printed circuit patterns are formed on both sides of an insulating board and chip components are mounted on the circuits on both sides, through holes are formed at the chip component mounting positions on the circuit pattern on one side. A double-sided circuit board characterized in that the circuit pattern reaches the other surface through the inner surface of the through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9549889U JPH0334269U (en) | 1989-08-14 | 1989-08-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9549889U JPH0334269U (en) | 1989-08-14 | 1989-08-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0334269U true JPH0334269U (en) | 1991-04-04 |
Family
ID=31644759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9549889U Pending JPH0334269U (en) | 1989-08-14 | 1989-08-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0334269U (en) |
-
1989
- 1989-08-14 JP JP9549889U patent/JPH0334269U/ja active Pending