JPH03117867U - - Google Patents
Info
- Publication number
- JPH03117867U JPH03117867U JP2698290U JP2698290U JPH03117867U JP H03117867 U JPH03117867 U JP H03117867U JP 2698290 U JP2698290 U JP 2698290U JP 2698290 U JP2698290 U JP 2698290U JP H03117867 U JPH03117867 U JP H03117867U
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- wiring board
- printed wiring
- component
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Description
第１図は本考案の第１の実施例の縦断面図、第
２図は第１図の平面図、第３図は本考案の第２の
実施例の縦断面図、第４図は従来の印刷配線板の
一例の縦断面図である。
１……印刷配線板、２……絶縁基材、３……部
品実装用スルーホール、４……表裏導通用スルー
ホール、５……パツド、６……回路、７……銅め
つき層、８，９……金めつき層、１０……ベース
銅箔、１１ａ，１１ｂ……ランド、１２……はん
だ。
Fig. 1 is a longitudinal sectional view of the first embodiment of the present invention, Fig. 2 is a plan view of Fig. 1, Fig. 3 is a longitudinal sectional view of the second embodiment of the invention, and Fig. 4 is a conventional FIG. 2 is a longitudinal cross-sectional view of an example of a printed wiring board of FIG. 1... Printed wiring board, 2... Insulating base material, 3... Through hole for component mounting, 4... Through hole for front and back conduction, 5... Pad, 6... Circuit, 7... Copper plating layer, 8, 9...Gold plating layer, 10...Base copper foil, 11a, 11b...Land, 12...Solder.
Claims (1)
ーホール挿入部品を搭載する部品実装スルーホー
ルを有する印刷配線板において、前記部品実装用
スルーホールの穴壁およびランド上に金めつきを
施したことを特徴とする印刷配線板。 (2) 部品実装用スルーホールの穴壁にのみ金め
つきを施したことを特徴とする第１項記載の印刷
配線板。[Scope of Claim for Utility Model Registration] (1) In a printed wiring board having a pad for mounting a surface mount component and a component mounting through hole for mounting a through hole insertion component, A printed wiring board characterized by gold plating. (2) The printed wiring board according to item 1, wherein only the hole walls of the through holes for component mounting are plated with gold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2698290U JPH03117867U (en) | 1990-03-16 | 1990-03-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2698290U JPH03117867U (en) | 1990-03-16 | 1990-03-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03117867U true JPH03117867U (en) | 1991-12-05 |
Family
ID=31529857
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2698290U Pending JPH03117867U (en) | 1990-03-16 | 1990-03-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03117867U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100497862B1 (en) * | 2000-12-19 | 2005-06-29 | 가부시끼가이샤 도시바 | Parts-housing substrate and the method of manufacturing the same |
-
1990
- 1990-03-16 JP JP2698290U patent/JPH03117867U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100497862B1 (en) * | 2000-12-19 | 2005-06-29 | 가부시끼가이샤 도시바 | Parts-housing substrate and the method of manufacturing the same |
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