JPH0298678U - - Google Patents
Info
- Publication number
- JPH0298678U JPH0298678U JP678489U JP678489U JPH0298678U JP H0298678 U JPH0298678 U JP H0298678U JP 678489 U JP678489 U JP 678489U JP 678489 U JP678489 U JP 678489U JP H0298678 U JPH0298678 U JP H0298678U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- closed
- electronic component
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の実施例に係るプリント配線用
基板の概略図である。第２図は第１図のプリント
配線用基板のプリント配線形成後の概略図である
。第３図は本考案の他の実施例を示す要部断面図
である。第４図は従来のプリント配線用基板の要
部断面図である。
１０……基板、１３，１４……銅メツキ、１６
，１７……スルーホール、１８，１９……挿入材
、２０……銅箔、２１……表面、２２……プリン
ト配線、２３，２４，３４……ハンダフイレツト
、２６，３２……チツプ部品、３１……フイルム
。
FIG. 1 is a schematic diagram of a printed wiring board according to an embodiment of the present invention. FIG. 2 is a schematic diagram of the printed wiring board of FIG. 1 after printed wiring is formed. FIG. 3 is a sectional view of a main part showing another embodiment of the present invention. FIG. 4 is a sectional view of a main part of a conventional printed wiring board. 10...Substrate, 13, 14...Copper plating, 16
, 17... Through hole, 18, 19... Insert material, 20... Copper foil, 21... Surface, 22... Printed wiring, 23, 24, 34... Solder fillet, 26, 32... Chip component, 31 ...Film.
Claims (1)
られているスルーホールを、穴埋め手段を用いて
塞いだことを特徴とする電子部品の実装構造。 An electronic component mounting structure characterized in that a through hole provided in a soldering land of a printed wiring board is closed using a hole filling means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP678489U JPH0298678U (en) | 1989-01-24 | 1989-01-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP678489U JPH0298678U (en) | 1989-01-24 | 1989-01-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0298678U true JPH0298678U (en) | 1990-08-06 |
Family
ID=31211243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP678489U Pending JPH0298678U (en) | 1989-01-24 | 1989-01-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0298678U (en) |
-
1989
- 1989-01-24 JP JP678489U patent/JPH0298678U/ja active Pending
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