JPH0430760U - - Google Patents
Info
- Publication number
- JPH0430760U JPH0430760U JP7109590U JP7109590U JPH0430760U JP H0430760 U JPH0430760 U JP H0430760U JP 7109590 U JP7109590 U JP 7109590U JP 7109590 U JP7109590 U JP 7109590U JP H0430760 U JPH0430760 U JP H0430760U
- Authority
- JP
- Japan
- Prior art keywords
- pad
- chip
- chip component
- mounting surface
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 3
- 229910000679 solder Inorganic materials 0.000 claims 2
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例を示す側面図、第２
図は同平面図、第３図ａ，ｂは同実施例のパツド
の形状例を示す平面図、第４図はこの種のチツプ
部品実装構造の従来例を示す側面図、第５図は同
平面図、第６図ａ，ｂは上記従来例の問題を示す
側面図である。
１……チツプ部品、２……プリント配線板、４
……半田、５……パツド。
Figure 1 is a side view showing one embodiment of the present invention;
3A and 3B are plan views showing an example of the shape of the pad of the same embodiment, FIG. 4 is a side view showing a conventional example of this type of chip component mounting structure, and FIG. 5 is the same. The plan view and FIGS. 6a and 6b are side views showing the problems of the above-mentioned conventional example. 1... Chip parts, 2... Printed wiring board, 4
...Handa, 5...Patsudo.
Claims (1)
ド上にチツプ部品を搭載し、このチツプ部品をリ
フロー半田付けもしくはデイツプ半田付けにより
、半田を介してプリント配線板に電気的および機
械的に接続するチツプ部品実装構造において、 前記パツドがチツプ搭載面と該チツプ搭載面か
ら外方に突出した突出面を有することを特徴とす
るチツプ部品実装構造。 ２ リフロー半田付けの場合は、半田塗布範囲を
パツドのチツプ搭載面のみとしたことを特徴とす
るチツプ部品実装構造。[Scope of Claim for Utility Model Registration] 1. A pad is formed on a printed wiring board, a chip component is mounted on the pad, and the chip component is attached to the printed wiring board via solder by reflow soldering or dip soldering. A chip component mounting structure that electrically and mechanically connects, wherein the pad has a chip mounting surface and a protruding surface that projects outward from the chip mounting surface. 2. In the case of reflow soldering, the chip component mounting structure is characterized in that the solder application area is only on the chip mounting surface of the pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7109590U JPH0430760U (en) | 1990-07-05 | 1990-07-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7109590U JPH0430760U (en) | 1990-07-05 | 1990-07-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0430760U true JPH0430760U (en) | 1992-03-12 |
Family
ID=31607824
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7109590U Pending JPH0430760U (en) | 1990-07-05 | 1990-07-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0430760U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003031937A (en) * | 2001-07-18 | 2003-01-31 | Sony Corp | Soldering land structure for surface mounting type component |
-
1990
- 1990-07-05 JP JP7109590U patent/JPH0430760U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003031937A (en) * | 2001-07-18 | 2003-01-31 | Sony Corp | Soldering land structure for surface mounting type component |