JPH02142451U - - Google Patents
Info
- Publication number
- JPH02142451U JPH02142451U JP5225989U JP5225989U JPH02142451U JP H02142451 U JPH02142451 U JP H02142451U JP 5225989 U JP5225989 U JP 5225989U JP 5225989 U JP5225989 U JP 5225989U JP H02142451 U JPH02142451 U JP H02142451U
- Authority
- JP
- Japan
- Prior art keywords
- adhesive layer
- masking tape
- circuit boards
- microparticles
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012790 adhesive layer Substances 0.000 claims description 6
- 230000000873 masking effect Effects 0.000 claims description 5
- 239000011859 microparticle Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
Landscapes
- Adhesive Tapes (AREA)
- Electroplating Methods And Accessories (AREA)
Description
第１図は本考案のマスキングテープの一実施例
の側面図、第２図は本考案のマスキングテープの
別実施例の側面図である。
１……基材、２……気泡状粘着剤層、３……未
発泡粘着剤層、５……熱膨張性マイクロ粒体。
FIG. 1 is a side view of one embodiment of the masking tape of the present invention, and FIG. 2 is a side view of another embodiment of the masking tape of the present invention. DESCRIPTION OF SYMBOLS 1...Base material, 2...Cubular adhesive layer, 3...Unfoamed adhesive layer, 5...Thermally expandable microparticles.
Claims (1)
基材の少なくとも一方面に設け、当該マイクロ粒
体を熱膨張させて粘着剤層を形成したことを特徴
とするプリント基板用または回路基板の端子部用
のマスキングテープ。 (2) 請求項(1)記載のマスキングテープの粘着剤
層上にさらに粘着剤層を設けたことを特徴とする
マスキングテープ。[Claims for Utility Model Registration] (1) An adhesive layer containing thermally expandable microparticles is provided on at least one surface of a base material, and the adhesive layer is formed by thermally expanding the microparticles. Masking tape for printed circuit boards or terminals of circuit boards. (2) A masking tape characterized in that an adhesive layer is further provided on the adhesive layer of the masking tape according to claim (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5225989U JPH02142451U (en) | 1989-05-02 | 1989-05-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5225989U JPH02142451U (en) | 1989-05-02 | 1989-05-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02142451U true JPH02142451U (en) | 1990-12-03 |
Family
ID=31572415
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5225989U Pending JPH02142451U (en) | 1989-05-02 | 1989-05-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02142451U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014125636A (en) * | 2012-12-26 | 2014-07-07 | Nitto Denko Corp | Sealing sheet |
-
1989
- 1989-05-02 JP JP5225989U patent/JPH02142451U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014125636A (en) * | 2012-12-26 | 2014-07-07 | Nitto Denko Corp | Sealing sheet |
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