JPH028170U - - Google Patents
Info
- Publication number
- JPH028170U JPH028170U JP8538088U JP8538088U JPH028170U JP H028170 U JPH028170 U JP H028170U JP 8538088 U JP8538088 U JP 8538088U JP 8538088 U JP8538088 U JP 8538088U JP H028170 U JPH028170 U JP H028170U
- Authority
- JP
- Japan
- Prior art keywords
- metal foil
- printed circuit
- release layer
- layer provided
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010410 layer Substances 0.000 claims description 5
- 239000011888 foil Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000012790 adhesive layer Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Description
第１図は本実施例の電気回路基板用転写体の断
面図を示すものであり、第２図は第１図の電気回
路基板用転写体を用いて成形して得られた回路基
板を示す斜視図である。
１……電気回路基板用転写体、２……金属箔、
３……剥離層、４……印刷回路層、５……接着剤
層。
Figure 1 shows a cross-sectional view of the transfer body for electric circuit boards of this example, and Figure 2 shows a circuit board obtained by molding using the transfer body for electric circuit boards of Figure 1. FIG. 1... Transfer body for electric circuit board, 2... Metal foil,
3...Peeling layer, 4...Printed circuit layer, 5...Adhesive layer.
Claims (1)
、この剥離層上に形成された印刷回路層と、この
印刷回路上に設けられた接着剤層よりなることを
特徴とする電気回路基板用転写体。 An electric circuit board comprising a metal foil, a release layer provided on the metal foil, a printed circuit layer formed on the release layer, and an adhesive layer provided on the printed circuit. Transfer material for use.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8538088U JPH028170U (en) | 1988-06-28 | 1988-06-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8538088U JPH028170U (en) | 1988-06-28 | 1988-06-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH028170U true JPH028170U (en) | 1990-01-19 |
Family
ID=31310051
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8538088U Pending JPH028170U (en) | 1988-06-28 | 1988-06-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH028170U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5911144B2 (en) * | 2010-07-02 | 2016-04-27 | 国立研究開発法人産業技術総合研究所 | Micro mechanical system |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61288489A (en) * | 1985-06-17 | 1986-12-18 | キヤノン株式会社 | Manufacture of molded circuit board |
-
1988
- 1988-06-28 JP JP8538088U patent/JPH028170U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61288489A (en) * | 1985-06-17 | 1986-12-18 | キヤノン株式会社 | Manufacture of molded circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5911144B2 (en) * | 2010-07-02 | 2016-04-27 | 国立研究開発法人産業技術総合研究所 | Micro mechanical system |