JPS61183564U - - Google Patents
Info
- Publication number
- JPS61183564U JPS61183564U JP6775985U JP6775985U JPS61183564U JP S61183564 U JPS61183564 U JP S61183564U JP 6775985 U JP6775985 U JP 6775985U JP 6775985 U JP6775985 U JP 6775985U JP S61183564 U JPS61183564 U JP S61183564U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- tip
- flexible
- board
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 3
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案の一実施例を説明するための斜
視図、第２図は本考案の一実施例の変形例を示す
斜視図、第３図は従来例を示す斜視図である。
１……回路基板、２……両面接着テープ、３…
…フレキシブル基板、４ａ，５ａ……銅箔部、６
……半田。
FIG. 1 is a perspective view for explaining an embodiment of the present invention, FIG. 2 is a perspective view of a modification of the embodiment of the present invention, and FIG. 3 is a perspective view of a conventional example. 1... Circuit board, 2... Double-sided adhesive tape, 3...
...Flexible board, 4a, 5a...Copper foil part, 6
……solder.
Claims (1)
て、前記フレキシブル基板の先端部分に形成され
、回路基板の所定回路パターンと半田付けされる
銅箔部と、前記銅箔部を含む先端部分を屈曲ある
いは湾曲させ、その一部が回路基板上に当接する
先端部と、前記フレキシブル基板と前記回路基板
間であつて、先端部を除く位置に介装された接着
部とを備えたことを特徴とするフレキシブル基板
の接続構造。 In the connection structure between a circuit board and a flexible board, a copper foil part is formed at the tip of the flexible board and is soldered to a predetermined circuit pattern of the circuit board, and the tip part including the copper foil part is bent or curved; A flexible substrate comprising: a tip portion of which a portion of the substrate contacts a circuit board; and an adhesive portion interposed between the flexible substrate and the circuit board at a position other than the tip portion. Connection structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6775985U JPS61183564U (en) | 1985-05-08 | 1985-05-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6775985U JPS61183564U (en) | 1985-05-08 | 1985-05-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61183564U true JPS61183564U (en) | 1986-11-15 |
Family
ID=30601876
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6775985U Pending JPS61183564U (en) | 1985-05-08 | 1985-05-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61183564U (en) |
-
1985
- 1985-05-08 JP JP6775985U patent/JPS61183564U/ja active Pending
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