JPS6364076U - - Google Patents
Info
- Publication number
- JPS6364076U JPS6364076U JP15876786U JP15876786U JPS6364076U JP S6364076 U JPS6364076 U JP S6364076U JP 15876786 U JP15876786 U JP 15876786U JP 15876786 U JP15876786 U JP 15876786U JP S6364076 U JPS6364076 U JP S6364076U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- terminal portion
- notch
- bulge
- circuit pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 7
- 238000005530 etching Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 239000012790 adhesive layer Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図〜第３図は本考案の実施例に係り、第１
図は要部分解斜視図、第２図は接続状態を示す要
部断面図、第３図は第１の基板の端子部の切欠き
の断面状態を示す要部断面図、第４図は従来例を
示す要部断面図である。
１……第１の基板、２……ベース基材、３……
接着剤層、４……回路パターン、５……端子部、
６……切欠き、７……第２の基板、８……フイル
ムベース、９……接着剤層、１０……回路パター
ン、１２……端子部、１３……膨出部、１４……
半田。
Figures 1 to 3 relate to embodiments of the present invention;
The figure is an exploded perspective view of the main part, Fig. 2 is a sectional view of the main part showing the connection state, Fig. 3 is a sectional view of the main part showing the cross-sectional state of the notch of the terminal part of the first board, and Fig. 4 is the conventional one. FIG. 3 is a sectional view of a main part showing an example. 1... First substrate, 2... Base substrate, 3...
Adhesive layer, 4... Circuit pattern, 5... Terminal part,
6... Notch, 7... Second substrate, 8... Film base, 9... Adhesive layer, 10... Circuit pattern, 12... Terminal portion, 13... Swelling portion, 14...
solder.
Claims (1)
、フレキシブルな第２の基板上の回路パターンの
端子部とを、半田付けで接続・固着する構成にお
いて、前記第１の基板の端子部にエツチングによ
る切欠きを形成すると共に、前記第２の基板の端
部の端子部先端を、前記切欠きに合致する形状の
膨出部として形成し、該膨出部をフイルムベース
を下側にして前記切欠きに嵌め合わせて前記両基
板の端子部同志を半田付けしたことを特徴とする
回路板の接続構造。 In a configuration in which a terminal portion of a circuit pattern on a hard first substrate and a terminal portion of a circuit pattern on a flexible second substrate are connected and fixed by soldering, the terminal portion of the first substrate is In addition to forming a notch by etching, the tip of the terminal portion at the end of the second substrate is formed as a bulge having a shape matching the notch, and the bulge is placed with the film base facing downward. A circuit board connection structure characterized in that terminal portions of both boards are soldered to each other by fitting into the notch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15876786U JPS6364076U (en) | 1986-10-16 | 1986-10-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15876786U JPS6364076U (en) | 1986-10-16 | 1986-10-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6364076U true JPS6364076U (en) | 1988-04-27 |
Family
ID=31082562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15876786U Pending JPS6364076U (en) | 1986-10-16 | 1986-10-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6364076U (en) |
-
1986
- 1986-10-16 JP JP15876786U patent/JPS6364076U/ja active Pending
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