JPH01145170U - - Google Patents
Info
- Publication number
- JPH01145170U JPH01145170U JP4085388U JP4085388U JPH01145170U JP H01145170 U JPH01145170 U JP H01145170U JP 4085388 U JP4085388 U JP 4085388U JP 4085388 U JP4085388 U JP 4085388U JP H01145170 U JPH01145170 U JP H01145170U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- terminal
- circuit board
- terminals
- connection structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 239000011889 copper foil Substances 0.000 claims description 11
- 229910000679 solder Inorganic materials 0.000 claims 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図は、本考案の実施例による回路基板の斜
視図、第２図は、回路基板の接続状態の断面図で
ある。
１……第２回路基板、１ａ……第２銅箔端子、
１ｂ……隆起部、１ｃ……端子支持片、２……第
１回路基板、２ａ……第１銅箔端子。
FIG. 1 is a perspective view of a circuit board according to an embodiment of the present invention, and FIG. 2 is a sectional view of the circuit board in a connected state. 1...Second circuit board, 1a...Second copper foil terminal,
1b... Protruding portion, 1c... Terminal support piece, 2... First circuit board, 2a... First copper foil terminal.
Claims (1)
と、前記複数の第１銅箔端子に対向して、第２回
路基板に形成された複数の第２銅箔端子とが押圧
接続される回路基板の接続構造において、 前記複数の第２銅箔端子を支持する端子支持片
を、各第２銅箔端子に対して独立的に形成し、前
記第２銅箔端子先端の前記第１銅箔端子との当接
部に、半田による隆起部を形成することを特徴と
する回路基板の接続構造。[Claims for Utility Model Registration] A plurality of first copper foil terminals formed on a first circuit board, and a plurality of second copper foil terminals formed on a second circuit board facing the plurality of first copper foil terminals. In the circuit board connection structure in which the plurality of second copper foil terminals are press-connected, a terminal support piece that supports the plurality of second copper foil terminals is formed independently for each second copper foil terminal, and the second copper foil terminal 1. A connection structure for a circuit board, characterized in that a protrusion made of solder is formed at a portion of a tip of a copper foil terminal in contact with the first copper foil terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4085388U JPH01145170U (en) | 1988-03-28 | 1988-03-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4085388U JPH01145170U (en) | 1988-03-28 | 1988-03-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01145170U true JPH01145170U (en) | 1989-10-05 |
Family
ID=31267313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4085388U Pending JPH01145170U (en) | 1988-03-28 | 1988-03-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01145170U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012039551A2 (en) * | 2010-09-20 | 2012-03-29 | 주식회사 미르엠케이 | Puzzle-type printed circuit board |
-
1988
- 1988-03-28 JP JP4085388U patent/JPH01145170U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012039551A2 (en) * | 2010-09-20 | 2012-03-29 | 주식회사 미르엠케이 | Puzzle-type printed circuit board |
| WO2012039551A3 (en) * | 2010-09-20 | 2012-05-18 | 주식회사 미르엠케이 | Puzzle-type printed circuit board |