JPS63128760U - - Google Patents
Info
- Publication number
- JPS63128760U JPS63128760U JP1965987U JP1965987U JPS63128760U JP S63128760 U JPS63128760 U JP S63128760U JP 1965987 U JP1965987 U JP 1965987U JP 1965987 U JP1965987 U JP 1965987U JP S63128760 U JPS63128760 U JP S63128760U
- Authority
- JP
- Japan
- Prior art keywords
- conductive foil
- solder reservoir
- board body
- soldering
- reservoir conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011888 foil Substances 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の実施例を示す図、第２図は実
施例の使用時の過程を示す断面図、第３図は四方
に端子をもつ多足部品の場合の半田溜め導箔の位
置を示す略図、第４図は半田溜め導箔を用いる場
合の第２の問題点を説明するための断面図、第５
図は従来の第１の問題点を説明するための平面図
である。
１……基板本体、２……多足部品、３……足、
４……配線用導箔、５……その半田付け部、１１
……半田溜め導箔、１２……貫通孔。
Fig. 1 is a diagram showing an embodiment of the present invention, Fig. 2 is a sectional view showing the process of using the embodiment, and Fig. 3 is the position of the solder reservoir conductive foil in the case of a multi-leg component with terminals on all sides. FIG. 4 is a cross-sectional view for explaining the second problem when using a solder reservoir conductive foil, and FIG.
The figure is a plan view for explaining the first conventional problem. 1... Board body, 2... Multi-legged component, 3... Legs,
4... Conductive foil for wiring, 5... Soldering part thereof, 11
...Solder reservoir conductive foil, 12...Through hole.
Claims (1)
をするため基板本体上に並設した複数個の配線用
導箔の半田付け部を結ぶ線上に該半田付け部と隣
接して半田溜め導箔を設けると共に、 この半田溜め導箔のほぼ中央部より上記基板本
体を貫通してその裏面に至る貫通孔を設けたこと
を特徴とするプリント配線基板。[Claim for Utility Model Registration] Soldering on a line connecting the soldering parts of a plurality of conductive foils for wiring arranged in parallel on the board body in order to electrically connect each leg of a multi-legged component on the same surface. A printed wiring board characterized in that a solder reservoir conductive foil is provided adjacent to the solder reservoir conductive foil, and a through hole is provided that penetrates the board body from approximately the center of the solder reservoir conductive foil and reaches the back surface thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1965987U JPH0537494Y2 (en) | 1987-02-13 | 1987-02-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1965987U JPH0537494Y2 (en) | 1987-02-13 | 1987-02-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63128760U true JPS63128760U (en) | 1988-08-23 |
| JPH0537494Y2 JPH0537494Y2 (en) | 1993-09-22 |
Family
ID=30814456
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1965987U Expired - Lifetime JPH0537494Y2 (en) | 1987-02-13 | 1987-02-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0537494Y2 (en) |
-
1987
- 1987-02-13 JP JP1965987U patent/JPH0537494Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0537494Y2 (en) | 1993-09-22 |